| Allicdata Part #: | ATS-10F-107-C3-R1-ND |
| Manufacturer Part#: |
ATS-10F-107-C3-R1 |
| Price: | $ 4.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10F-107-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.44150 |
| 30 +: | $ 4.19496 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal management has been a major issue in the electronics industry. Heat generation from electrical components has led to the need for efficient cooling solutions to allow the effective dissipations of heat inside the devices. To address this problem, thermal - heat sinks are used as a way of transferring the heat generated by the components away from the device. The ATS-10F-107-C3-R1 is a thermal - heat sink designed for cooling of modern electronic components. It is a fan-sink system composed of a CPU/GPU fan and a copper heat sink. The fan is designed with ultra slim blades to enable clear airflow, while the copper heat sink is built to maximize heat absorption and dissipation. The ATS-10F-107-C3-R1 thermal - heat sink provides superior cooling performance by taking advantage of its high efficiency fan and heat fins. The fan spins up to 2300RPM to achieve maximum cooling performance. The copper heat sink has low thermal resistance, which helps to effectively keep the components cooled. The heat sink fins are designed with a saw tooth profile to promote better air flow to dissipate the heat directly away from the device.The ATS-10F-107-C3-R1 fan-sink system is particularly well suited for modern processor-intensive applications. It is designed to provide adequate cooling for gaming PCs, media editing systems, and other consumer electronics. In addition, it is also optimized to support overclocking of components for improved performance. This thermal - heat sink is designed to mount easily and provide a reliable cooling solution, even when the temperature in the environment is extremely hot. To facilitate assembly, the ATS-10F-107-C3-R1 comes with a clip-on mounting system, which allows the device to be easily mounted on the cooling module. The ATS-10F-107-C3-R1 fan-sink system also includes a temperature monitoring and control feature, which helps to ensure that the desired temperature is maintained. The fan can be automatically adjusted based on the desired temperature. The fan speed is adjustable from 800RPM to 2300RPM to provide adequate cooling for different applications. Overall, the ATS-10F-107-C3-R1 is a cost effective thermal - heat sink solution that offers reliable cooling performance and easy installation. It is designed to meet the cooling needs of most modern electronic components, and its ability to support component overclocking helps to ensure that the components are cooled to their optimal levels. The built-in temperature control feature makes it easy to maintain the desired temperature, allowing the device to stay properly cooled.
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ATS-10F-107-C3-R1 Datasheet/PDF