| Allicdata Part #: | ATS-10F-111-C1-R1-ND |
| Manufacturer Part#: |
ATS-10F-111-C1-R1 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-111-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.90455 |
| 30 +: | $ 4.63176 |
| 50 +: | $ 4.35935 |
| 100 +: | $ 4.08694 |
| 250 +: | $ 3.81448 |
| 500 +: | $ 3.54201 |
| 1000 +: | $ 3.47390 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks have become essential components in many electronic systems due to their ability to efficiently dissipate heat from sensitive components. The ATS-10F-111-C1-R1 thermal solution, a type of heat sink designed for mobile electronics applications, is an example of the advancements in thermal design that can be used to meet the demanding thermal requirements of today’s electronics. This article will explore the features, applications, and working principles of this thermal solution.
The ATS-10F-111-C1-R1 heatsink is designed to provide efficient cooling in portable electronics using a simple yet sophisticated design. The heatsink is made from a lightweight aluminum alloy and has a slim profile, allowing it to fit into tight spaces. It also features a fully sealed design to prevent dirt and debris from entering the interior of the device. The ATS-10F-111-C1-R1 heatsink is also designed with an internally integrated fan that can be used to boost the heatsink’s performance when additional airflow is needed. This type of heat sink is typically used in mobile electronics such as cell phones, tablets, PDAs, and other mobile devices.
The working principle of the ATS-10F-111-C1-R1 heat sink relies on the physics of thermodynamics. Heat is generated by the electronics and then transferred away from the device by the heat sink. As the heat is transferred, it is dissipated through the heat sink’s fins. The internal fan provides additional airflow which helps to further dissipate the heat by spreading it across the fins. This increased airflow also helps to reduce hot spots on the heatsink, ensuring even cooling across the entire device.
The ATS-10F-111-C1-R1 heat sink is designed to provide superior thermal performance for a variety of applications. It is often used in portable electronics due to its slim profile and light weight. It is also commonly used in industrial applications, such as motor controllers, switchgear, and industrial PC systems. This thermal solution is also designed to provide reliable cooling in high-altitude and high-temperature environments, making it an ideal choice for applications in aerospace and military.
In conclusion, the ATS-10F-111-C1-R1 thermal solution is a type of heat sink designed for mobile electronics applications. This heat sink is designed to provide efficient cooling in tight spaces with a fully sealed design. It also features an integrated fan to increase airflow, and is designed for reliable cooling in high-altitude and high-temperature environments. The ATS-10F-111-C1-R1 is, therefore, an ideal choice for a range of applications, making it one of the most popular thermal solutions in the market.
The specific data is subject to PDF, and the above content is for reference