| Allicdata Part #: | ATS-10F-125-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-125-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-125-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have found their applications in numerous electronic systems. The ATS-10F-125-C1-R0 is one of these specialised thermal devices. It is a high-performance cooling solution with superior thermal performance, low noise and high efficiency. This thermal device is suitable for application areas ranging from consumer electronics to aviation electronics.
This device is composed of a copper base, fins, integrated fins, and heat-sink body. The copper base uses state-of-the-art heat dissipation techniques to ensure efficient heat transfer from the processor or high-end graphic card to the fins in a timely manner. The fins are designed with a radial geometry to ensure optimal thermal conductivity. This radial geometry minimizes the thermal profile of the fins, allowing for efficient transfer of heat energy from the base to the environment.
The integrated fins are precisely manufactured to ensure uniform heat dissipation throughout the extended surface area. This standardized geometry ensures optimal heat transfer even when the device is mounted on a limited area. The heat-sink body is made of high-grade aluminum alloy to provide a lightweight but durable construction. This body is designed with an exclusive convex shape to maximize airflow and reduce turbulence.
The working principle of the ATS-10F-125-C1-R0 is quite simple. Heat energy produced by the processor or graphic card is transferred to the fins through the base. The fins then dissipate this energy to the environment via natural airflow. This device has been designed with optimal configurations and materials to ensure superior performance and reliability.
The ATS-10F-125-C1-R0 is an ideal solution for high-end game consoles, graphic cards, and processors, where heat dissipation is of utmost importance. The device is easy to install with its mounting brackets and screws. Moreover, the low-noise design ensures that the device does not create any audible distractions. Therefore, it is ideal for use in commercial, gaming and aviation electronic applications.
The specific data is subject to PDF, and the above content is for reference