| Allicdata Part #: | ATS-10F-152-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-152-C1-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-152-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47130 |
| 30 +: | $ 3.37743 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10F-152-C1-R0 thermal - heat sink is a reliable and durable product designed to help transfer heat away from a number of integrated circuits and other electronic components. The product is used in computers, automotive and medical electronics and many other applications. It is mainly used for cooling, cooling the components that would otherwise get too hot due to excessive power consumption.
The ATS-10F-152-C1-R0 thermal - heat sink is made out of a solid aluminum base and a series of metal fins, which are all connected to each other by the base. These fins allow a natural convection of cooling air to enter and circulate through the fins. The heat transfer from the components is then conducted through these fins, thus cooling the components and allowing them to run at optimum performance levels.
The ATS-10F-152-C1-R0 thermal - heat sink has two main components - the base and the fins. It is constructed with an aluminum base that has an anodized finish, which allows for increased heat dissipation. The fins are made out of high durability nickel and are positioned in such a way that they create maximum contact with the components, thereby transferring the heat away quickly and efficiently. The base has mounting points for any number of components, making installation easy. The fins are also designed to vibrate, which helps increase the amount of surface area for heat dissipation.
The ATS-10F-152-C1-R0 thermal - heat sink works in a very simple yet effective way. Heat is generated from the components that are being cooled and it is then conducted through the fins, which are connected to the base. Heat is then quickly and efficiently dissipated away from the components, thereby cooling them and letting them run at optimal performance levels. As the fins vibrate, more air is brought into the fins and circulated, which helps to improve the cooling process.
ATS-10F-152-C1-R0 thermal - heat sinks can be used in a variety of applications, including computers, automotive and medical electronics. Additionally, they are designed to be used with various types of CPUs, graphics cards, and hard drives. This product is also designed to withstand temperatures up to 250°F, making it a great choice for cooling in extreme environments.
The ATS-10F-152-C1-R0 thermal - heat sink is a reliable, long-lasting and effective way to transfer undesirable heat away from integrated circuit boards and other electronic components. It has a strong aluminum base with nickel fins and is designed for a variety of applications. Its vibration and convection cooling technologies help increase the cooling efficiency, thus allowing electronic components to work at maximum performance levels.
The specific data is subject to PDF, and the above content is for reference