
Allicdata Part #: | ATS-10F-18-C3-R0-ND |
Manufacturer Part#: |
ATS-10F-18-C3-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X15MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.89781 |
30 +: | $ 3.68151 |
50 +: | $ 3.46487 |
100 +: | $ 3.24834 |
250 +: | $ 3.03178 |
500 +: | $ 2.81523 |
1000 +: | $ 2.76109 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Introduction:
A Thermal Heat Sink (also known as a heatsink) is a device used to dissipate unwanted heat from electronic components and other objects. The ATS-10F-18-C3-R0 is a thermal heat sink designed for applications requiring the effective dissipation of heat. In this article, we will discuss the application fields and working principle of the ATS-10F-18-C3-R0 thermal heat sink.
Application Fields:
The ATS-10F-18-C3-R0 thermal heat sink is particularly designed for applications requiring the effective dissipation and cooling of electronics. It is suitable for use in military and industrial equipment, scientific and medical equipment, communications equipment, consumer electronics, and personal computers.
The ATS-10F-18-C3-R0 is designed to reduce operating temperature and maintain safe and consistent temperature levels. This is particularly important in applications where temperatures can rise quickly and significantly. In these situations, the ATS-10F-18-C3-R0 thermal heat sink can help maintain more efficient operation and extend the life of the equipment by cooling it effectively.
The ATS-10F-18-C3-R0 is also designed for use in air-cooled and liquid-cooled systems. It can be used in systems with high airflow, and it is also suitable for applications where the cooling system is located in an enclosed environment.
Working Principle:
The ATS-10F-18-C3-R0 thermal heat sink works on the principle of convection. Heat is transferred from the electronic component or object to the heat sink’s aluminum fins, which dissipate the heat and reduce the temperature of the component or object. The aluminum fins are designed with a high surface area, which allows a greater amount of heat to be dissipated.
The ATS-10F-18-C3-R0 thermal heat sink is designed with an open fin design. This design is advantageous in that it allows air to circulate more freely around the fins. This helps to further dissipate heat and allows the heat sink to function more efficiently.
The ATS-10F-18-C3-R0 thermal heat sink is designed with a U-shaped clip to help secure it to the mounting surface. The clip is designed to ensure that the heat sink remains secure in all conditions, and the clip also has rubber openings that serve as vibration dampeners to further reduce operating noise levels.
Conclusion:
The ATS-10F-18-C3-R0 thermal heat sink is a well-designed and highly efficient device that can effectively and safely dissipate heat away from electronic components and other objects. Its open fin design further increases its cooling efficiency, and its U-shaped clip helps to ensure that the heat sink stays securely mounted to the mounting surface. With its broad range of applications and superior cooling performance, the ATS-10F-18-C3-R0 thermal heat sink is an invaluable tool for any cooling operation.
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