ATS-10F-181-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-10F-181-C3-R0 is a heat sink model designed by ATS Thermal Products. It is used to efficiently dissipate unwanted heat generated through various including computers, home appliances and industrial equipment. This model was specifically designed to be extremely reliable and durable for use in various applications. The heat sink model is made of aluminum, and has a spring-tension clip for secure mounting during use.

Design and Construction

The overall design of the ATS-10F-181-C3-R0 heat sink is quite simple. It is constructed of a single solid block of aluminum alloy that is machined to provide a thin profile and a large surface area which provides greater heat dissipation capabilities. The heat sink is then finished with a black anodized coating, which provides increased corrosion resistance.In order to provide for secure mounting, the heat sink is equipped with a spring-tension clip to firmly attach the heat sink to the source of heat. The clip is designed with a stainless steel band which firmly secures the heat sink to the device. The clip has two holes; one is used for mounting and the other is used for a side-to-side attachment. Furthermore, the unit has a through-hole to attach mounting screws, and has a slotted design which allows it to be easily adjusted for optimal installation.

Working Principle

The ATS-10F-181-C3-R0 heat sink works by dissipating heat away from its source. This is achieved through a process called convection, which is the transfer of heat from one material to another through direct contact. The heat sink is designed to maximize convection due to its large surface area, which increases the amount of airflow around the component it is attached to. This airflow helps to draw heat away from the component, thus allowing the device to stay cool and allowing for higher performance.In order to fully optimize performance, the heat sink must be installed correctly and securely. It should be placed close to the source of the heat and it should be firmly attached to the device using the supplied spring-tension clip. Additionally, thermal compound should be applied to the surfaces that will come into contact with each other. This will increase the transfer of heat from the device to the heat sink, further improving performance.

Application Field and Benefits

The ATS-10F-181-C3-R0 is a reliable and durable thermal device. It can be used in a variety of applications and devices, such as computers, home appliances, industrial equipment, and other electronic components. This model is also effective for daily operations since it has been designed to offer high performance levels with minimal maintenance.The ATS-10F-181-C3-R0 can be used in many applications since it can transfer massive amounts of heat in a reliable and secure manner. By using the right thermal compound and securely attaching the heat sink to the device, this model is an effective and efficient way to properly cool devices and equipment, and to prevent them from overheating. Furthermore, it is easy to install, requires low maintenance, and is highly durable.

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