ATS-10F-198-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10F-198-C3-R0-ND

Manufacturer Part#:

ATS-10F-198-C3-R0

Price: $ 3.58
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10F-198-C3-R0 datasheetATS-10F-198-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.25710
30 +: $ 3.16932
50 +: $ 2.99326
100 +: $ 2.81717
250 +: $ 2.64109
500 +: $ 2.55305
1000 +: $ 2.28894
Stock 1000Can Ship Immediately
$ 3.58
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-10F-198-C3-R0 Application Field and Working Principle

What are thermal heat sinks and what is their main purpose? The term heat sink refers to a device that is used for transferring heat from one component to another, usually from an electronic chip to a larger heat exchanger, with the goal of cooling the components. Heat sinks are usually used in association with energy-dissipating components, such as CPUs, GPUs, and various other processors which produce a lot of heat during their operation. The purpose of heat sinks is to provide a means for safely and efficiently dissipating the heat generated by these components, thus allowing them to function properly.

The ATS-10F-198-C3-R0 is a thermal heat sink system with an aluminum extrusion base, a high performance cooling capacity of 1550W, and an overall dimension of 243.8 mm x 63.5 mm x 28.2 mm. This heat sink offers excellent thermal performance, with high-quality aluminum extrusion fans providing superior air ventilation. It also features an advanced thermal management system, including integrated heat-dissipating fins that effectively maximize the assistance of the fans.

In order to effectively cool electronic components, the ATS-10F uses a steady flow of air to remove heat from the heat-sources to its thermal heat sink. This process is called passive cooling. By providing a large area of metal fins to absorb and transfer heat from the component to the air, the heat can be reliably absorbed and dissipated away from the heat source, allowing the component to continue working at optimal temperatures.

The ATS-10F also has a unique quick-mounting bracket system, which allows for easier and faster fan mounting and assembly. This is great for reducing the time and money spent on cooling components, as fittings, fixtures, and screws are not required in the installation process. Additionally, the ATS-10F is UL Listed and RoHS-compliant, providing greater assurance of quality and safety.

The ATS-10F is a great choice for a variety of applications, such as automotive, telecommunications, medical, and computer applications, among many others. It is also suitable for industrial and domestic applications, such as home theater systems, personal computers, and gaming consoles. With its advanced design, reliable performance, and excellent thermal management, the ATS-10F thermal heat sink is the perfect solution for a variety of cooling needs.

In conclusion, the ATS-10F provides an efficient and reliable means for cooling various electronic components. It has an efficient design, high-quality construction, and a unique quick-mounting bracket system. With its advanced thermal management system and ease of use, the ATS-10F is an excellent choice for a variety of applications. Whether you’re cooling a computer, gaming console, or home theater system, the ATS-10F thermal heat sink is the perfect solution for optimal cooling.

The specific data is subject to PDF, and the above content is for reference

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