| Allicdata Part #: | ATS-10F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-10F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10F-200-C3-R0
Application field and working principle
Thermal management has become a critical issue for today’s engineers because of ever-increasing power densities. As the power density rises, the operating temperature increases until it reaches a thermally-unstable threshold and thermal runaway occurs. In order to deal with this, engineers are turning to the ATS-10F-200-C3-R0.The ATS-10F-200-C3-R0 is a heat sink meant to quickly and efficiently dissipate heat from electronic components. The heat sink is made of aluminium, which is preferred as a material for thermal management since it is lightweight, strong, non-corrosive and inexpensive. While larger heat sinks are more efficient, the ATS-10F-200-C3-R0 is designed to be small and compact, making it ideal for use in small, confined spaces.The ATS-10F-200-C3-R0 works by using an aerodynamic fin design to increase the surface area exposed to the environment. This increased surface area creates more area to dissipate heat, which helps to reduce the temperature of the electronic components being cooled. The fins also allow air to flow freely over the surface, making the heat sink more effective.The ATS-10F-200-C3-R0 is primarily used in power supply systems to cool the components within the system. This is due to its efficient cooling capabilities in a small package. It is also used for thermal management systems used in many electronic products, such as laptops, desktop PCs, TVs and phones. The ATS-10F-200-C3-R0 is highly regarded for its high performance, low cost and ease of use.In conclusion, the ATS-10F-200-C3-R0 is an ideal solution for thermal management in electronic components. Its small size and efficient cooling capabilities make it the ideal choice for use in power supply systems and thermal management systems in many electronic products. It is also highly regarded for its affordability and ease of use.
The specific data is subject to PDF, and the above content is for reference