| Allicdata Part #: | ATS-10F-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10F-209-C1-R0 is a thermal heat sink designed for medium to large processor applications. It combines the features of an air-cooled heat sink and a liquid-cooled heat sink into one, creating an efficient, cost-effective solution for aiding the processor’s cooling. An extensive range of materials, sizes and configurations are available to meet the needs of a variety of applications.
The ATS-10F-209-C1-R0 utilizes an extruded aluminum design for improved heat transfer and light weight. It is typically attached to the processor or component through mounting clips, but can also be mounted directly using standard screws. The fins on the unit are configured to provide maximum air flow, ensuring efficient cooling and reducing overall noise levels. Additionally, the unit is optimized for use with standard fans, enabling easy installation and troubleshooting.
The ATS-10F-209-C1-R0 features a two-piece design with a built-in liquid-cooling system. A piped coolant is routed from the processor or component to the liquid channels located inside the heat sink. This liquid is then circulated by a small thermal pump that is attached to the heat sink. As the liquid is circulated through the channels, it absorbs heat from the processor or component and transports it to the ambient air. The heat is then dissipated into the surrounding environment by the finned aluminum casing.
The ATS-10F-209-C1-R0 has a built-in thermal control system that can prevent overheating and offers improved performance. The system utilizes a temperature sensor that is connected to the motherboard or processor that detects any changes in temperature. If the temperature is too high, the system will automatically reduce the power being supplied to the processor for additional protection. Additionally, the unit is designed to reduce vibration and noise levels, allowing the processor to remain in a state of quiet operation while still protecting it from thermal damage.
The ATS-10F-209-C1-R0 offers improved reliability and higher performance compared to traditional air-cooled heat sinks. The built-in liquid-cooling system adds an extra layer of protection by allowing the processor to run cooler, reducing the risk of thermal damage. Additionally, the unit is designed to be flexible and adjustable, allowing users to customize the unit to fit their specific needs. The ATS-10F-209-C1-R0 is an ideal choice for medium to large processor applications and can provide years of reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference