ATS-10F-36-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-10F-36-C2-R0 Thermal Heat Sink:The ATS-10F-36-C2-R0 thermal heat sink is an efficient means of cooling electronic components and systems with high power density. This type of dissipator is designed to draw in and dissipate the heat from a component, aiding in its preventive maintenance. The heat generated by an overheating component can be damaging and can cause permanent damage or even reduced performance if left unchecked.Application Field:The ATS-10F-36-C2-R0 thermal heat sink is commonly used in a variety of electronics applications, such as power supplies, servers, personal computers, telecommunications equipment, automotive electronics, and consumer electronics. In addition, the mechanical features and versatility of this heat sink make it suitable for use in applications that require a robust and reliable solution to manage dissipation requirements. This includes, but is not limited to, applications in computer motherboards, automotive electronics, audio electronics, and LED lighting applications. Working Principle:The ATS-10F-36-C2-R0 thermal heat sink works by using the natural principles of air movement to dissipate heat. It utilizes a combination of technology to transfer heat away from components, which prevents it from causing damage and/or malfunction. The heat sink consists of a frame and several fins that are arranged along the entire length of the frame. The fins have a staggered pattern that increases the surface area, making them better at dispersing heat. Air is passed over the fins, which allows the heat to be transferred away from the component and eventually out of the dissipator.The design of the heat sink also allows for maximum airflow, which is essential to achieving effective heat dissipation. Also, the increased airflow helps to keep the components operating at their optimal temperature, which improves the overall performance of the system.Conclusion:The ATS-10F-36-C2-R0 thermal heat sink is an efficient and reliable means of cooling components and systems. Its design features and mechanical features make it an ideal solution for a variety of applications. It works by taking advantage of natural air movement to dissipate heat away from components, thus preventing damage and malfunction. With its high power density cooling capability, the ATS-10F-36-C2-R0 is an optimal choice for cooling components and maintaining safe and optimal operating temperatures.

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