| Allicdata Part #: | ATS-10F-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-10F-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat transfer is the process of transferring heat energy from one point to another. The ATS-10F-38-C2-R0 utilizes the thermal transfer properties of copper to effectively move heat away from components that produce too much heat. This innovative device is composed of a single-piece outer frame sourced from a high-grade cold rolled steel which effectively forms a closed loop thermal circuit.
The ATS-10F-38-C2-R0 is designed to dissipate the heat concentrated within an electronic device via conduction. Its outer steel frame is adjustable, allowing engineers to tailor their installations to suit any application. This heat sink also allows for rapid heat transfer, as its large surface area efficiently releases thermal energy away from the hot-spot areas in its electrical components.
The working principle relies on the fact that the hotter a material, the faster the thermal energy flows from it into an adjacent cooler material, and vice versa. In order for efficient heat transfer, the ATS-10F-38-C2-R0 relies on unhindered contact between the outer steel frame and the heatsink. The steel frame is perpendicular to the heatsink and their surfaces are in contact with each other.
As the heated electronic component emits its heat, it is carried away by the ATS-10F-38-C2-R0 to an area outside the component where its temperature is lower and less heat will be produced. This process continues as the ATS-10F-38-C2-R0 rapidly absorbs heat from the electronic component, transporting it away from the hot spot area where it can safely dissipate without causing overheating or damage to the device.
The ATS-10F-38-C2-R0 can be used in a wide range of applications, such as power supplies, switches, and LED lighting control systems. Its high quality, efficient heat transfer capabilities, and low maintenance requirements make it an ideal choice for these applications. By removing the heat more quickly and in a controlled manner, the device helps prevent overheating of electronic components and can reduce their risk of failure over time.
Overall, the ATS-10F-38-C2-R0 is a powerful and efficient heat sink unit that finds application in many different electronic devices. Its adjustable steel frame, efficient heat transfer, and low maintenance requirements make it an ideal choice for cooling power supplies, switches, LED lighting control systems, and other electronic components. With this device, engineers can ensure that their electronic components are working safely and optimally.
The specific data is subject to PDF, and the above content is for reference