Allicdata Part #: | ATS-10F-52-C1-R0-ND |
Manufacturer Part#: |
ATS-10F-52-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X25MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-10F-52-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.10275 |
30 +: | $ 3.01896 |
50 +: | $ 2.85125 |
100 +: | $ 2.68349 |
250 +: | $ 2.51579 |
500 +: | $ 2.43193 |
1000 +: | $ 2.18034 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
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ATS-10F-52-C1-R0 Application Field and Working PrincipleThe ATS-10F-52-C1-R0 is a thermal heat sink, a device designed to maintain a low temperature in electrical systems by actively absorbing heat. This type of heat sink is designed to primarily disperse heat from electrical components, eliminating the risk of thermal runaway or component failure due to overheating. They are commonly used in a variety of applications, including computer systems, medical devices, industrial electronics, communications equipment, and aerospace hardware.The basic operational principle behind this type of heat sink is fairly straightforward. Heat is absorbed by one side of the sink, typically through contact with the component where the heat originates from. This heat is then transferred through the organic heat carrier material, typically a thermal grease, which evenly spreads the heat across the entire sink\'s surface. This heat is then dissipated away from the sink due to either the convection or radiation of the heat into the surrounding air.Typically, the ATS-10F-52-C1-R0 heat sink is designed in such a way that the heat will be dissipated away from the heat source, allowing for maximum cooling potential. This is also achieved by the copper or aluminum fins of the sink, which further dissipates heat away from the source. The ATS-10F-52-C1-R0 heat sink is designed with an extended fan base to ensure that the fan\'s blades are in direct contact with the fins, further improving heat transfer.The size of the ATS-10F-52-C1-R0 heat sink can vary depending on the application, as can its shape and material. Common materials used in the construction of the heat sink include copper, aluminum, and plastic. The size, shape, and material are all carefully chosen to ensure that the maximum amount of heat is dissipated away from the source, providing the most efficient cooling possible.In order to achieve the best possible cooling performance, the heat sink should be installed in such a way that the fan base is in direct contact with the fins of the sink. The fan should also be directed towards an area with free flow of air, allowing for maximum air flow and cooling potential. Additionally, the heat sink should be inspected regularly to ensure that all components are functioning properly.Overall, the ATS-10F-52-C1-R0 heat sink is a reliable and efficient way to maintain a low temperature in many different applications, from electronics to aerospace. The heat sink is carefully designed to maximize air flow and heat dissipation, thereby ensuring the most efficient cooling performance possible. By following the recommended installation instructions and conducting regular maintenance inspections, the ATS-10F-52-C1-R0 heat sink can provide many years of reliable service.The specific data is subject to PDF, and the above content is for reference
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