| Allicdata Part #: | ATS-10F-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are designed to cool down and maintain a computer’s temperature level. Heat sinks are a key component in such systems. The ATS-10F-72-C1-R0 is a top-of-the-line thermal heat sink – a metallic device that dissipates heat away from a microprocessor or integrated circuit by using a combination of conduction, convection, and radiation.
The ATS-10F-72-C1-R0 is known for its superior cooling abilities due to its high efficiency and large surface area. Its design includes a coil shape with internal hidden fins which serve to increase its surface area and dissipate heat. Additionally, the heat sink consists of a series of heat pipes, which act as efficient heat conductors, and a fan designed to increase air flow. In order to maximize its cooling potential, the ATS-10F-72-C1-R0 is engineered with four air-cooled corners and four liquid-cooled corners. This unique design creates an effective balance between air and liquid-cooled corners, providing a uniform cooling system.
The ATS-10F-72-C1-R0 is ideal for many applications such as industrial, automotive, computer, and medical systems. It works by dissipating heat through two processes. First, the copper cold plate provides an efficient way to transfer heat away from the component and the heat sink. Second, the fan and air-cooled corners work together to increase the surface area and ensure optimal air flow. By doing this, heat is distributed evenly across the surface, minimizing hotspots and allowing for efficient cooling.
The ATS-10F-72-C1-R0 is designed with a unique combination of technologies that maximizes its cooling performance and efficiency. The fan’s air-flowing fins use a combination of convection and radiation to dissipate heat and create a temperature controlled environment. Additionally, the heat pipes provide efficient and effective heat transfer by drawing heat away from the component and the heat sink. This ensures that the processor or integrated circuit remains cool and runs efficiently.
The ATS-10F-72-C1-R0 heat sink is a crucial component for efficient thermal management systems. It is designed with a unique combination of advanced technologies that results in superior cooling performance and high efficiency. Its unique design enables it to quickly and effectively remove heat from components, allowing computers to run more smoothly and efficiently.
The specific data is subject to PDF, and the above content is for reference