| Allicdata Part #: | ATS-10F-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-10F-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks technology is used to efficiently transfer heat from a device into the surrounding environment. The primary purpose of a heat sink is to dissipate large amounts of thermal energy over a given area in order to protect the device from overheating. This can be achieved through both direct and indirect heat transfer methods. The most common type of heat sink is the ATS-10F-75-C3-R0.
The ATS-10F-75-C3-R0 is a high eccentricity, high air-flow, and low noise, two-piece heat spreader, made of high temperature thermally conductive aluminum material. It has a 75 mm fan, and provides excellent cooling performance by transferring heat from the device to the environment. The ATS-10F-75-C3-R0 is suitable for a variety of applications, such as power supply units, long-term I/O systems, CPU coolers, and other high-end thermal devices. It can be used in any environment with high ambient temperature.
In order to achieve the best efficiency when using the ATS-10F-75-C3-R0, the device must be properly mounted and connected. The two-piece heat spreader consists of two pieces; one large piece is fixed onto the device, and the other smaller piece is attached to the surface of the device. This creates a space between the two pieces in which air can flow freely, thus evenly distributing the heat from the device onto the fins. The fan directs air through the fins, dissipating the heat from the device into the environment.
The ATS-10F-75-C3-R0 heat sink is an efficient way to keep a device cool and prevent it from overheating. Its efficient cooling performance and low noise make it a great option for many applications. The aluminum construction of the heat spreader ensures reliable performance, while the 75 mm fan helps to ensure that the device is properly cooled. In addition, the ATS-10F-75-C3-R0 requires minimal installation, making it ideal for many devices.
The specific data is subject to PDF, and the above content is for reference