| Allicdata Part #: | ATS-10F-82-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-82-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-82-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10275 |
| 30 +: | $ 3.01896 |
| 50 +: | $ 2.85125 |
| 100 +: | $ 2.68349 |
| 250 +: | $ 2.51579 |
| 500 +: | $ 2.43193 |
| 1000 +: | $ 2.18034 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10F-82-C1-R0 is one of the most widely used thermal heat sinks on the market today. Its popularity is due to its reliable performance and energy-saving design. The ATS-10F-82-C1-R0 is made of copper and is designed to dissipate heat away from sensitive components. It is highly effective in cooling applications such as server rooms, data centers, and communications equipment.
The ATS-10F-82-C1-R0 is designed with an efficient air flow pattern that allows for maximum cooling. A single unit can dissipate up to 3 kW of heat with a low profile design. The base is made from an alloy of copper and aluminum which ensures that the sink can dissipate heat quickly and efficiently. The base of the unit is made from a copper powder that is then plated with nickel and stainless steel. This ensures that the ATS-10F-82-C1-R0 can handle the thermal energy demands of high performance components.
The ATS-10F-82-C1-R0 has an innovative mounting system that utilizes patents pending latching arm technology. This allows for quick and secure mounting between the sink and the component. The sink has a sleek design that allows for the maximum heat dissipation. The sink also has a low profile height which reduces the overall height of the system.
ATs-10F-82-C1-R0 heat sink is designed to work in tandem with ambient air. This means that the heat generated by components is dissipated by a combination of air and thermal conduction. As the air flows across the sink, it absorbs some of the heat generated by the components. This heat is then transferred to the fins of the sink, which act as a heat sink. The fins then disperse the heat into the surrounding air, taking advantage of the natural convection of the air to dissipate the heat more quickly and efficiently.
The ATS-10F-82-C1-R0 also features an integrated fan system that helps to increase the efficiency of the thermal conduction. The fan provides additional airflow and also helps to keep the temperature of the components within a safe range. The fan can be adjusted to the desired speed to adjust the cooling capacity and to ensure that the components are kept within their optimal temperature range.
In addition to its thermal dissipation capabilities, the ATS-10F-82-C1-R0 is also designed to ensure the reliability of the system. It is designed with quality in mind and is backed by a 3-year warranty. The sink is also UL listed and has been tested for safety. This ensures that the thermal heat sink performs as expected.
The ATS-10F-82-C1-R0 is an efficient thermal heat sink that can help to ensure the proper functioning of any system. Its efficient air flow design and its ability to dissipate heat quickly and efficiently make it one of the most popular thermal heat sinks on the market. Its compact size and low profile design make it ideal for applications such as server rooms, data centers, and communications equipment. With its reliable performance and safety-tested design, the ATS-10F-82-C1-R0 is an excellent choice for any thermal heat sink.
The specific data is subject to PDF, and the above content is for reference