| Allicdata Part #: | ATS-10F-85-C3-R0-ND |
| Manufacturer Part#: |
ATS-10F-85-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-85-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
ATS-10F-85-C3-R0 is a type of thermal-heat sink that can be used for cooling or temperature control in various electronics applications. It is composed of a cylindrical body, an annular fin, an inward mounting attachment and a load-bearing base. The annular fin is designed to create a heat conduction path between the air and the substrate, promoting dissipation of heat. The base provides a durable and sturdy anchor for the heat sink. It is also designed to be compact and lightweight, making it easy to install into a confined area.
Application Field
ATS-10F-85-C3-R0 thermal heat sinks are designed for effective thermal management in a wide range of electronic devices including computers, processors, and military-grade equipment. It can be used in a wide range of applications in the areas of medical electronics, industrial automation, automotive electronics, defense systems, and aerospace systems. It is also ideal for cooling boards and hot spots in high power electronics.
The ATS-10F-85-C3-R0 is also used in refrigerators, heat pumps, and air conditioners to dissipate heat generated by the compressor unit. It is also popular in networking and telecom applications where high power electronic components generate considerable amounts of heat. The ATS-10F-85-C3-R0 has been designed to withstand vibration and shock and will provide reliable and consistent thermal performance even in the most challenging environments.
Working Principle
The ATS-10F-85-C3-R0 thermal-heat sink is designed to disperse the heat generated by an electronic device and reduce its operating temperature. The interior of the heat sink is lined with an annular fin that creates a conduction path between the air and the device’s substrate, allowing heat to dissipate quickly. The heat is then transferred to the outer surface of the heat sink and is dissipated by natural convection of air.
The ATS-10F-85-C3-R0 also uses a load-bearing base to act as an anchor for the heat sink. This ensures that the heat sink remains securely attached to the electronic device, allowing for optimal thermal performance. The load-bearing base also helps to reduce the amount of noise generated by the heat sink.
Conclusion
ATS-10F-85-C3-R0 thermal heat sinks are designed to provide efficient cooling solutions for a wide range of electronic devices and applications. The annular fin creates a conduction path between the air and the substrate, allowing heat to dissipate quickly. The load-bearing base provides a stable anchor for the heat sink and helps reduce noise generated from the fan. The lightweight design of the ATS-10F-85-C3-R0 makes it an ideal cooling solution in even the most confined spaces.
The specific data is subject to PDF, and the above content is for reference