| Allicdata Part #: | ATS-10G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-10G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly essential as electronic components and devices continue to get smaller and more advanced. More efficient thermal design can increase component life, maintain peak performance, and ultimately improve the reliability of the systems. One of the key elements of successful thermal management is heat sinks. Heat sinks play an essential role in dissipating excess heat from components and devices so that they remain within their normal operating temperatures.
ATS-10G-10-C1-R0 is a highly reliable and efficient 10W heat sink, which is especially designed for embedded electronic system applications. It features a compact, smoothly finned extruded aluminum construction that dissipates heat effectively and quickly while also promoting optimal airflow.
The design and construction of ATS-10G-10-C1-R0 utilize an integrated fin-and-tube system, which combines stretch-forming and extrusion techniques for improved efficiency and long-term reliability. The large heat sink fin area features more fins for a higher thermal capacity while its unique design also provides optimal space utilization. The heat sink is designed to be virtually maintenance-free, as it requires no additional cleaning or lubrication.
In terms of application field, ATS-10G-10-C1-R0 is ideally suited for use in a variety of embedded systems, including LED lighting, medical instrumentation, military, telecom, and industrial equipment. Its high-performance design makes it an ideal choice for a wide range of applications where superior cooling performance is needed.
The working principle of ATS-10G-10-C1-R0 is based on the principles of heat dissipation. When a device generates heat, the heat is absorbed by the heat sink\'s metal fins, which conduct its heat away from the device. The fins are designed to maximize the surface area of the heat sink, so that the generated heat can be quickly dispersed away from the device.
The heat sink also contains a fan, which helps to further draw the heat away from the device. In addition to cooling the device, the fan helps to prevent the heat from building up, which can lead to a decrease in the device\'s performance. Additionally, the fan draws in fresh air from outside the system to further cool the device.
ATS-10G-10-C1-R0 is a highly reliable and efficient heat sink for a variety of applications. Its advanced design and construction offers superior cooling performance, ensuring longer component and device life. By using this type of heat sink, designers and system integrators can ensure that their electronics and devices stay at optimal performance levels, as well as reliable and safe operation.
The specific data is subject to PDF, and the above content is for reference