| Allicdata Part #: | ATS-10G-110-C1-R1-ND |
| Manufacturer Part#: |
ATS-10G-110-C1-R1 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-110-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential requirement for the performance of any electronic device or system. Heat sinks are one of the common thermal management solutions. They provide an efficient way to dissipate heat away from the device or system. ATS-10G-110-C1-R1 is a heat sink designed to meet the thermal management requirements of higher power electronic systems.The ATS-10G-110-C1-R1 is a high-performance heat sink designed to dissipate heat efficiently away from electronic parts, components, and systems. It consists of an aluminum base and 110 fins arranged in an optimized pattern for maximum heat dissipation. The ATS-10G-110-C1-R1 is designed for use with 10G high-power electronic systems. Its large surface area and optimized fin pattern help to dissipate the heat generated by the components quickly and efficiently.The ATS-10G-110-C1-R1 is designed for easy installation and use. It features pre-drilled mounting holes and special heat-resistant glue to secure the fins in the correct position. This ensures that the fins are securely attached to the aluminum base, providing a snug fit to ensure that the heat is dissipated quickly and efficiently.The ATS-10G-110-C1-R1 is designed to be used with 10G electronic systems, such as processors, GPUs, and FPGAs. Its large surface area and optimized fin pattern provide quick and efficient heat dissipation for the components. The ATS-10G-110-C1-R1 is a cost-effective and efficient way to dissipate heat away from sensitive components, preventing them from overheating and protecting the system from damage.The ATS-10G-110-C1-R1 is a reliable and effective thermal management solution for 10G electronic systems. Its optimized fin pattern allows for efficient heat dissipation, and its large surface area allows for efficient dissipation of heat from the components. Its pre-drilled mounting holes make for easy installation and use, and its heat-resistant glue ensures that the fins are securely attached to the aluminum base. The ATS-10G-110-C1-R1 is a cost-effective and reliable way to provide efficient thermal management for 10G electronic systems.
The specific data is subject to PDF, and the above content is for reference