| Allicdata Part #: | ATS-10G-114-C3-R0-ND |
| Manufacturer Part#: |
ATS-10G-114-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-114-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.53°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to ATS-10G-114-C3-R0
ATS-10G-114-C3-R0 is a thermal heat sink designed for areas where mechanical and electrical noise need to be kept to a minimum. The heat sink is designed to be used in a wide range of temperature applications, from temperatures starting at -30°C to temperatures as high as +125°C. The device makes use of a combination of its physical construction and thermal conductive technology to efficiently dissipate heat from hot spots in electronic components like IGBTs and other power transistors. It is constructed using a flat plated aluminum body with a very high thermal conductivity of 350 W/mK, allowing the heat sink to efficiently remove heat from the component.
Application Field of ATS-10G-114-C3-R0
ATS-10G-114-C3-R0 can be used on a variety of devices such as transformers, motors, and power semiconductor packages. It is suitable for a wide range of applications including automotive, power supplies, server and telecommunication equipment, and drives. It is also suitable for hybrid and electric vehicles, high reliability applications, and complex mounting styles. Overall, it is an ideal choice for high current and power density applications.
The device has a very high-power capacity with a wide range of operating temperatures. When using the device, the surface temperature of the component to be cooled will not exceed a thermal resistance of 0.180°C/W. This ensures that the device is able to efficiently remove heat from the component, protecting it from damage due to over-temperatures.
Working Principle of ATS-10G-114-C3-R0
The ATS-10G-114-C3-R0 works by using thermally conductive technology to absorb and dissipate heat. The device is made up of a base plate, a central copper core, and a number of pins sticking out from the base plate. These pins create air flow channels around the component, allowing air to be circulated throughout the device and ensuring efficient distribution of the thermal energy. The end result is that the overall surface temperature remains cool and safe, even in high temperature environments.
The device also has a flat plated aluminum body with a thermal conductivity of 350 W/mK. This allows the heat sink to quickly and efficiently absorb heat from the component, cooling it and ensuring a long life of the component. Additionally, the pins create a vertical and horizontal pattern that maximizes the air flow, allowing for more efficient dissipation of heat.
Finally, the device is designed to minimize sound and reduce EMI and EMS radiation. This is done by incorporating a unique enclosure with very high-density polyurethane foam, which helps to insulate and reduce interference. Additionally, the device also has a special coating on the base plate that helps to reduce thermal radiation.
Conclusion
The ATS-10G-114-C3-R0 is an efficient thermal heat sink that is suitable for a variety of applications. Its combination of thermal conductive technology and physical construction helps to dissipate heat efficiently and safely, while its enclosure and special coating help to reduce sound and minimize any EMI, EMS, or thermal radiation. Overall, it is an ideal choice for high current and power density applications.
The specific data is subject to PDF, and the above content is for reference