ATS-10G-126-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.47°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal – Heat Sinks is an important component in electronic and thermal designs. It is used to absorb heat generated by certain components in the design, like integrated circuits, and dissipate the heat to the air further away from the component, which is essential to maintain them from excessive heat. The ATS-10G-126-C2-R0 is a type of Thermal – Heat Sink that combines both good thermal conductivity and low resistance for a higher thermal dissipation level, thus making it suitable for high-end electronic designs. It has a set of highly sophisticated features and functions, which can make it an ideal choice for industrial applications.

Design and Construction

The ATS-10G-126-C2-R0 is constructed from high-quality aluminium and copper alloy materials, which can provide excellent thermal conductivity and low resistance. The aluminium material works to effectively transfer heat from the chip, while the copper alloy helps to further dissipate the heat away from the device. It has two 40mmx40mm fan mounting slots, and a 40mmx20mm fan, with a 4-pin connector, for enhanced cooling. The fan can be set to run at a relative high speed, thus providing a good amount of airflow to absorb the heat generated from the components.

Application Field and Benefits

The ATS-10G-126-C2-R0 can be used for a variety of applications, such as electronic devices, home entertainment systems, industrial equipments, and even computer motherboards. Its small size and low profile make it very well suited for densely packed designs, and its high-quality materials are conducive to dissipating the heat generated from the components. Furthermore, the fan allows for a better airflow to keep the components cooled off, and thus improve their lifespan.

Working Principle

The ATS-10G-126-C2-R0 is designed to provide effective and reliable thermal management for high-end electronic designs. It works by first transferring the heat from the component away from it, typically to the copper base of the heat sink, which then spreads the heat out over the entire body. The aluminium body then absorbs this heat, and releases it to the surrounding air. The fan further enhances the rate of heat dissipation by providing a mechanism for a more efficient airflow and thus causing the heat to dissipate faster.

Conclusion

The ATS-10G-126-C2-R0 is a type of Thermal – Heat Sink specifically designed to provide optimal thermal management in high-end electronic designs. It offers good thermal conductivity and low resistance, along with two fan mounting slots for further cooling. The small size and low profile are very well suited for densely packed designs, and its high-quality materials are also conducive to dissipating the heat generated from the components. The ATS-10G-126-C2-R0 is a great choice for a variety of applications, ranging from electronic devices to industrial equipments, where thermal management is critical.

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