ATS-10G-14-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS18138-ND

Manufacturer Part#:

ATS-10G-14-C2-R0

Price: $ 4.35
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10G-14-C2-R0 datasheetATS-10G-14-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.95640
10 +: $ 3.85182
25 +: $ 3.63787
50 +: $ 3.42380
100 +: $ 3.20979
250 +: $ 2.99580
500 +: $ 2.78181
1000 +: $ 2.72832
Stock 1000Can Ship Immediately
$ 4.35
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-10G-14-C2-R0 application field and working principle

Thermal - Heat Sinks

The ATS-10G-14-C2-R0 is an industrial-grade heat sink designed for high performance electronics. It is suitable for use in a variety of applications, including telecommunications, automotive, medical, military, and consumer electronics. The ATS-10G-14-C2-R0 provides efficient thermal and electrical power management solutions for sensitive applications.

The ATS-10G-14-C2-R0 is composed of a metal mountable heat sink base which is designed to provide heat diffusion as well as efficient removal of heat from high-power components. The base has a high thermal conductivity and provides an increased surface area for cooling. The heat sink base is stiffened by multiple cooling fins which have a high thermal conductivity within the cooling area. The fins serve to spread the heat evenly over the entire surface, improving thermal performance.

The ATS-10G-14-C2-R0 heat sink has an engineered structure for minimum thermal resistance. This heat sink is designed to increase airflow, and its shape makes it easier to install in tight spaces. Additionally, the heat sink can be used with different power supplies to help reduce noise and reduce heat buildup. The heat sink is designed to dissipate heat quickly, regardless of the orientation of the structure, allowing for greater efficiency in cooling.

The ATS-10G-14-C2-R0 provides a cost-efficient and reliable solution for thermal management in industrial applications. The heat sink is designed to withstand high temperatures and can function in temperatures up to 200°C. With high efficiency and reliable cooling, this type of heat sink is an ideal solution for high performance electronics, and applications that require robust and long lasting cooling.

The ATS-10G-14-C2-R0 heat sink is designed to provide efficient heat dissipation and thermal management. The engineered structure eliminates noise and eliminates hot spots and provides optimal cooling. The dimensions of the heat sink are customized to fit any type of application, and its low profile design makes it suitable for tight spaces. In addition, the heat sink’s flexible mounting options provide versatility and flexibility for installers.

The ATS-10G-14-C2-R0 is designed with an innovative construction that increases thermal efficiency and reduces total cost of ownership. The heat sink is designed to efficiently dissipate heat from the components and the fins allow for a higher overall thermal conductivity. The low profile heatsink is perfect for applications that require thermal management but do not require excessive cooling capacity. The ATS-10G-14-C2-R0 is suitable for high performance and sensitive applications and is a cost-effective and reliable solution for thermal management.

The specific data is subject to PDF, and the above content is for reference

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