ATS-10G-171-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10G-171-C1-R0-ND

Manufacturer Part#:

ATS-10G-171-C1-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10G-171-C1-R0 datasheetATS-10G-171-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.11472
30 +: $ 3.03051
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the most important aspects of any electrical device or system. Heat sinks are mechanical heat-absorbing devices used to help reduce the amount of heat generated by electrical systems. The ATS-10G-171-C1-R0 is a specific heat sink designed for high-temperature applications. It can be used in applications ranging from medical to aerospace to industrial. In this article, we will discuss the application field and working principle of the ATS-10G-171-C1-R0.

The ATS-10G-171-C1-R0 is a high-temperature thermal management device that can handle up to 200°C of sustained temperature and up to 250°C of short-term temperature. It is designed with a robust aluminum frame and fins held together by press-fit construction for optimal peak performance. The extrude-air flow technology also helps in better dispersing of heat for a more efficient thermal management. With its highly effective thermal resistance of 0.02 C/W, the ATS-10G-171-C1-R0 is a great choice for applications with high-temperature requirements.

The ATS-10G-171-C1-R0 is designed for LED lighting, industrial control, power semiconductor cooling, and general-purpose thermal management for industrial, automotive, and aviation applications. It is also suitable for outdoor and enclosed installation locations. The design of the ATS-10G-171-C1-R0 also allows it to be used in any environment, including high humidity levels. With its compact form, the ATS-10G-171-C1-R0 is an ideal selection for many space-limited areas.

The ATS-10G-171-C1-R0 is a forced air convection type of heat sink, which means that air is blown directly onto the heat sink’s fins to ensure effective heat transfer. This method of thermal management helps to transfer heat away from the device efficiently, preventing it from getting too hot. The ATS-10G-171-C1-R0 is also equipped with a temperature sensor for additional protection from overheating.

In conclusion, the ATS-10G-171-C1-R0 is an excellent heat sink for high-temperature applications. It is designed to dissipate heat away from the device and has a robust construction for peak performance. The ATS-10G-171-C1-R0 also has an effective thermal resistance of 0.02 C/W and a temperature sensor for additional protection. With its capability to handle sustained temperatures of up to 200°C, the ATS-10G-171-C1-R0 is an ideal selection for LED lighting, industrial control, power semiconductor cooling, and general-purpose thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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