| Allicdata Part #: | ATS-10G-189-C3-R0-ND |
| Manufacturer Part#: |
ATS-10G-189-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-189-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component of all electronic devices. Their primary purpose is to help dissipate the heat generated by the processor or other component. The specific heat sink used is dependent on the power requirements of the system, ambient temperatures, and other environmental factors. The ATS-10G-189-C3-R0 heat sink is a versatile component that can be used for a variety of applications.
The ATS-10G-189-C3-R0 heat sink is constructed from aluminum and has an anodized surface. It is designed to provide superior heat transfer and optimal cooling performance even in the hottest environments. The heat sink has a finned design with a total height of 88.9mm and a width of 89mm. It also features an integrated fan mount system that allows for easy installation and removal.
The thermal characteristics of the ATS-10G-189-C3-R0 heat sink allow for a wide range of environmental conditions. This includes temperatures as low as -40°C and as high as 100°C. The heat sink also features a low internal impedance, which helps to protect components from damage due to thermal shock. This is an important factor in preventing failure due to overheating.
The ATS-10G-189-C3-R0 heat sink can be used in a variety of applications. This includes applications such as power supplies, LEDs, and RF components. The heat sink is also well-suited for use in gaming consoles, electronic toys, and other consumer electronics. Additionally, the heat sink can also be used in industrial applications such as heat generating systems or light fixtures.
The working principle of the ATS-10G-189-C3-R0 heat sink is relatively simple. Heat travels from the heat source and transferred to the finned aluminum surface of the heat sink. As air passes over the surface, it carries away the heat energy dissipated by the heat sink. The heat is then dissipated into the environment, thus keeping the components running at their optimal temperature.
In summary, the ATS-10G-189-C3-R0 heat sink is a versatile and reliable component for thermal management. Its wide range of environmental ratings and finned design make it suitable for use in a variety of applications. Its low internal impedance also helps protect components from damage due to thermal shock. Finally, the working principle of the heat sink is relatively simple and effective, allowing for optimal cooling performance in all environments.
The specific data is subject to PDF, and the above content is for reference