| Allicdata Part #: | ATS-10G-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-10G-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential to ensure electronic devices remain within their operating temperature. Heat sinks are commonly used as part of such solutions, and one such device is the ATS-10G-192-C1-R0. This article will explore its application field and working principle.
The ATS-10G-192-C1-R0 is a 2U-thick heat sink designed for server-grade applications requiring thermal dissipation. It consists of two coplanar heat sinks, each of which contain 192 aluminum fins with a packing density of 36/cm2. This design makes it an excellent choice for applications with small space restrictions due to its thinness.
The ATS-10G-192-C1-R0 is designed to dissipate heat efficiently at a wide range of temperatures, with an optimal operating range of 0°C to 60°C. Its low thermal resistance of 0.062°C/W ensures high performance and excellent heat dissipation. In addition, its low wind speed of 0.346 – 0.40 m/s ensures that even low-speed fans can effectively cool devices.
The device’s working principle is simple and efficient. Heat is transferred from a device to the aluminum fins of the heat sink via conduction. The fins then dissipate the heat into the surrounding air due to their large surface area. A built-in fan helps to increase the rate of heat transfer by increasing airflow speed over the fins. This creates an airstream which draws in cooler air and expels the now-warmer air, effectively cooling the device.
In short, the ATS-10G-192-C1-R0 is an effective and reliable thermal management solution for applications with small space restrictions. Its low thermal resistance and wide operating range ensure excellent heat dissipation and optimal device performance. Furthermore, its effective working principle ensures that even low-speed fans can help strengthen the airflow and further improve the device’s cooling capabilities.
The specific data is subject to PDF, and the above content is for reference