| Allicdata Part #: | ATS-10G-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-10G-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions provide a range of heat sink devices and equipment to control the temperature of an environment. The ATS-10G-200-C3-R0 is a low profile, compact heat sink designed for applications in which a limited amount of space is available. It is composed of an aluminum base with a central copper heat sink and 10mm fin spacing for maximum thermal conductivity.
The ATS-10G-200-C3-R0 heat sink is ideally suited for a variety of applications such as heat dissipating components in LED lighting, electronics, military, telecommunication base station, and computer cabinet systems. It is designed to provide efficient cooling of components such as ICs, transistors, and other power devices which generate high temperatures. Additionally, the ATS-10G-200-C3-R0 can be used with an optional fan to further decrease operating temperatures even in high ambient temperature environments.
The ATS-10G-200-C3-R0 heat sink works on the principle of thermodynamics. The concept of thermodynamics is based on the exchange of energy between two systems. In the ATS-10G-200-C3-R0 heat sink, the aluminum base acts as the hot side of the system and the fins are the cold side. The heat is transferred from the hot side to the cold side through conduction. This happens as the aluminum base absorbs heat from the hot components and then dissipates it into the fins, which has a larger surface area for greater heat dissipation.
The ATS-10G-200-C3-R0 heat sink is designed for applications cutting down on space requirements. It features low thermal resistance and high performance. The copper heat sink and aluminum base provide superior thermal conductivity and its 10mm fin spacing ensures maximum cooling power. The heat sink also includes two clips to securely attach the device to a heatsink or other components.
The ATS-10G-200-C3-R0 is a reliable and cost-effective solution for managing heat levels in applications such as LED lighting, electronics, military, telecommunication base station, and computer cabinet systems. Its robust construction and efficient design allow it to remain operational under severe conditions. Moreover, it is easy to install and provides a cost-effective way to control temperatures for many different systems.
The specific data is subject to PDF, and the above content is for reference