ATS-10G-25-C3-R0

Thermal management is crucial for achieving optimal performance from a device’s components. Heat sinks are designed to capture, transfer, and dissipate heat which are generated by the device’s components during operation. The ATS-10G-25-C3-R0 is a new type of high-performance aluminum heat sink specifically designed for higher power applications supporting multiple devices with its unique fin configuration.

The ATS-10G-25-C3-R0 is a single-piece aluminum extrusion with a fin configuration of 25. It is capable of providing up to 10W of thermal dissipation. The heat sink is optimized for use in applications with high power and current consumption devices such as ASICs, GPUs, and CPUs. The unique fin configuration of 25 allows for greater cooling efficiency, as it increases the surface area without increasing the overall thickness of the heat sink.

The ATS-10G-25-C3-R0 is designed for effective performance in various usage scenarios. The heat sink features a design that optimizes airflow for superior cooling with minimal waste of energy. It is made from aluminum alloy extrusion to provide maximum strength and rigidity in extreme operating conditions. The heat sink has an anodized black finish and a corrosion-resistant coating to ensure that it remains functional for a long period of time, even in high humidity and corrosive environments.

The ATS-10G-25-C3-R0 heat sink is designed for improved thermal efficiency through its special fin configuration. The fins are spread out in an array, which increases the heat transfer surface area while also decreasing airflow loss. This enables the heat sink to maximize the amount of air and thermal energy dissipated, leading to improved dissipation efficiency. The fin elements also provide additional air flow turbulence, improving heat transfer and resulting in enhanced cooling performance.

The ATS-10G-25-C3-R0 is designed to assist in the removal of heat from high-power devices. The unique fin configuration allows for superior cooling efficiency, with its improved turbulence leading to increased convective heat transfer. The heat sink also helps reduce the operating temperature of the device, which improves the overall reliability and life of the device components. The high tensile strength of the aluminum alloy ensures maximum durability in all operating conditions, which makes this heat sink a perfect choice for a wide variety of applications.

The ATS-10G-25-C3-R0 is a great choice for applications with multiple high power devices due to its high cooling efficiency and durability. It is an excellent choice for a wide range of applications including industrial and consumer electronics, gaming systems, personal computers, automotive electronics, telecommunications, and power equipment. The heat sink’s fin configuration ensures superior cooling performance, which makes it an ideal choice for applications with limited space.