ATS-10G-37-C3-R0

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Thermal management solutions play an important role in the production of advanced electronic devices and components, especially in areas with high temperatures and extreme environmental conditions. For such applications, various cooling and thermoelectric solutions have been developed to maintain performance. The ATS-10G-37-C3-R0 is a high performance, ruggedized thermoelectric cooling device that is designed to provide efficient cooling and support high temperatures with minimal disruption. The device has been designed for applications requiring reliable thermal management in extreme environmental conditions.

ATS-10G-37-C3-R0 Application Fields

ATS-10G-37-C3-R0 is commonly used in military, aerospace, industrial, and medical applications. In these environments, it is important to have reliable cooling for high-performance electronic components such as processors and microchips. The device can be used for a variety of cooling applications including electronics cooling, military applications, avionics cooling, and industrial applications. It is also suitable for use in medical applications where medical diagnostics and imaging systems require precise control of temperature.

ATS-10G-37-C3-R0 Working Principle

The ATS-10G-37-C3-R0 utilizes a thermoelectric cooling technology to reduce the temperature of the target area. A thermoelectric module is made up of two ceramic plates connected by a thermoelectric element. When electricity is passed through the module, the plates experience different levels of heat. One plate, the “hot plate”, absorbs heat from the environment while the other plate, the “cold plate”, dissipates the heat away. The device supports passive cooling, an active cooling mechanism, or both simultaneously.

The device is designed to provide cooling of the target area by actively managing the temperature of the environment around the components. A controller is used to adjust the temperature of the thermoelectric element for optimal thermal performance. This controller can adjust the temperature of the cold plate from 0 to 150°C, while keeping the hot plate at a temperature within 10°C. The effect of the thermoelectric cooling device is that a temperature differential is created, and heat is moved from the hot plate to the cold plate, thus cooling the targeted area.

ATS-10G-37-C3-R0 Heat Sink

The ATS-10G-37-C3-R0 includes a heat sink to reduce the temperature of the target components. This is done by dissipating the heat away from the hot plate and into the surrounding environment. The heat sink is designed with a high-performance, low-profile design that maximizes thermal performance and reduces the need for forced air-cooling. The heat sink is designed to evenly distribute the heat around the target area, ensuring that the temperature does not exceed the safe level.

The ATS-10G-37-C3-R0 includes a cover for the hot plate, which is designed to prevent damage to the target components. The cover is designed to be easy to install and remove, allowing for maintenance and service of the device without compromising performance.

Conclusion

The ATS-10G-37-C3-R0 is an advanced thermoelectric cooling device designed for use in extreme environments where reliable thermal management is required. The device leverages a thermoelectric cooling technology to reduce the temperature of the target area, and includes a heat sink for efficient cooling. The device is designed for use in military, aerospace, industrial, medical, and other applications. With its rugged construction, efficient cooling, and precise temperature control, the ATS-10G-37-C3-R0 is an ideal solution for environments with high temperatures and extreme environmental conditions.

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