ATS-10G-50-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS18233-ND

Manufacturer Part#:

ATS-10G-50-C2-R0

Price: $ 3.72
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10G-50-C2-R0 datasheetATS-10G-50-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.38310
10 +: $ 3.29301
25 +: $ 3.20393
50 +: $ 3.02602
100 +: $ 2.84798
250 +: $ 2.67002
500 +: $ 2.58101
1000 +: $ 2.31400
Stock 1000Can Ship Immediately
$ 3.72
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical for any electronic system, and ATS-10G-50-C2-R0 is one of the most efficient products on the market. Heat sinks are designed to manage heat produced by electronic components. The ATS-10G-50-C2-R0 heat sink is a passive heat transfer device and performs the important task of dissipating the heat away from electronic components.

The ATS-10G-50-C2-R0 is designed to fit a range of applications, including industrial and commercial uses. This heat sink has a slim radiative/ conduction fin design that provides maximum heat dissipation to protect your electronic components. The high effective thermal resistance and low-profile design make it a great choice for electronic systems that require small amounts of heat dissipation.

This heat sink has a finned pin with a low resistance-to-temperature rating. It also has a specially designed base with an active thermal part, which dissipates heat evenly. This ensures that your electronic components don\'t overheat and are always working at optimum levels. The thermal part of the heat sink is coated with an ultra-durable, highly conductive material that improves its overall performance. Additionally, the lightweight design of the ATS-10G-50-C2-R0 ensures that it can easily be added to your electronic systems without taking up too much space.

In addition to its good thermal dissipation capabilities, the ATS-10G-50-C2-R0 also features a reliable structural design. Its compact construction means that it can fit in tight spaces without sacrificing performance. This makes it a great choice for high-density applications. Additionally, its unique pin-less design allows it to reduce the cost of securing it to heat sinks or circuit boards.

The ATS-10G-50-C2-R0 is designed to be highly reliable and efficient in dissipating heat. It also features a robust temperature rating and is resistant to corrosion and oxidation. This ensures that it can handle the toughest of thermal environments. It also has a high dielectric strength and is UL and CSA listed for safety.

The ATS-10G-50-C2-R0 heat sink is an excellent choice for any electronic system that requires efficient thermal management. Its slim radiative/conduction fin design ensures maximum heat dissipation, while its lightweight design allows it to be added to tight spaces. With its excellent thermal performance, reliable structural design, and corrosion and oxidation resistance, it is a great choice for a range of industrial and commercial applications.

The specific data is subject to PDF, and the above content is for reference

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