| Allicdata Part #: | ATS18246-ND |
| Manufacturer Part#: |
ATS-10G-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10G-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10G-63-C2-R0 is a multipurpose and compact thermal related device that can be used in a variety of situations. It utilizes the latest in material science to offer superior heating and cooling capabilities. It is designed to be a cost-effective solution for operations that require high levels of temperature control. The ATS-10G-63-C2-R0 is categorized under the Thermal - Heat Sinks category, and is most commonly used in cooling circuits, automotive applications, and machines with multiple moving parts. The high thermal efficiency of the device ensures consistent temperatures, making it the ideal choice for many operations.
Application Fields
The ATS-10G-63-C2-R0 can be used effectively in a variety of applications. It is often used in the cooling circuits for desktop computers, servers, and other electronic equipment that require consistent temperatures. The device is also used in automotive applications, such as radiator fan cooling systems, and in home appliance motors that require high temperature control. Additionally, machines with multiple moving parts, such as robotics and manufacturing machinery, can also benefit from the ATS-10G-63-C2-R0’s thermal efficiency.
The ease of installation and maintenance makes it the ideal solution for applications that have limited space. It is often used in small corners and tight spaces, such as laptop computers. Additionally, the device is extremely reliable and can be used in applications that require consistent temperatures. The low-cost of the device further adds to its cost-effective viability.
Working Principle
The ATS-10G-63-C2-R0 utilizes a special material and coating to give it superior heating and cooling capabilities. The device utilizes a combination of aluminium and copper to create a hollow air chamber that dissipates heat over a larger area. The hollow copper and aluminium compound also absorbs and transfers heat away from the system. The device then uses advanced technology to control the temperature to keep consistent temperatures.
The device also utilizes the advanced surface area coating to further increase the thermal efficiency of the device. This coating provides an additional layer of protection that prevents heat from escaping from the air chamber. Additionally, the coating also provides air circulation that helps the device remain cool. All these features make the ATS-10G-63-C2-R0 an effective solution for operations that require high levels of temperature control.
The ATS-10G-63-C2-R0 is an ideal solution for companies that require a reliable thermal device. The combination of sophisticated material science and advanced technology make it a cost-effective solution for operations that require high levels of temperature control. The device can be used in a variety of applications, including cooling circuits, automotive applications, and machines with multiple moving parts. With its reliable performance and efficient thermal efficiency, the ATS-10G-63-C2-R0 is an ideal thermal solution for any application.
The specific data is subject to PDF, and the above content is for reference