ATS-10G-65-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10G-65-C1-R0-ND

Manufacturer Part#:

ATS-10G-65-C1-R0

Price: $ 4.02
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10G-65-C1-R0 datasheetATS-10G-65-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.65526
30 +: $ 3.45198
50 +: $ 3.24904
100 +: $ 3.04592
250 +: $ 2.84286
500 +: $ 2.63980
1000 +: $ 2.58903
Stock 1000Can Ship Immediately
$ 4.02
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.27°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks like the ATS-10G-65-C1-R0 are a crucial component in the cooling of high-performance systems. This type of heat sink is an active device that is used to dissipate thermal energy from CPUs and other components to prevent overheating. By increasing the surface area of the heat sink, heat is transferred away faster by utilizing air or liquid-based cooling solutions.

The ATS-10G-65-C1-R0 is a popular heat sink solution for multi-purpose applications. It is one of the most widely used passive heat sinks on the market and is compatible with a wide range of CPUs as well as graphics cards. It consists of a copper base, an aluminum fin array, and a top cover that directs the air flow to the cooling fins. The copper material helps to quickly transfer heat away from the CPU and is further enhanced by the aluminum fin array, which effectively dissipates heat efficiently to the surrounding environment.

The ATS-10G-65-C1-R0\'s working principle is relatively simple. When the CPU is running at high speeds, thermal energy is generated and must be dissipated. The heat sink transfers this thermal energy away from the CPU by means of conduction. Heat is conducted from the CPU to the copper base of the heat sink where it is then absorbed. The aluminum fin array then dissipates the heat into the surrounding air. Fans can be added to the heat sink to further improve cooling performance.

The ATS-10G-65-C1-R0\'s compatibility with a wide range of CPUs and GPUs make it a great option for any consumer looking for an efficient cooling solution. It is also a popular choice for overclockers who need a reliable and cost-effective cooling solution. The heat sink\'s design ensures an optimal level of cooling performance to prevent overheating and can handle thermal loads of up to 150W.

In conclusion, the ATS-10G-65-C1-R0 is an excellent choice for anyone looking for a reliable and cost-effective cooling solution. Its high level of compatibility, efficient working principle, and optimal cooling performance make it one of the top-rated heat sinks on the market. With its cost-effective price point, it is a great value option that will provide efficient cooling performance for any system.

The specific data is subject to PDF, and the above content is for reference

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