ATS-10G-75-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-10G-75-C1-R0 Application Field and Working Principle

A thermal - heat sink is a device used to dissipate heat from a component or assembly by transferring the thermal energy away from the component or assembly and into an environment of higher temperature. The goal is to maintain the temperature of the component or assembly below the critical temperature that would otherwise cause irreversible damage to the system or components. ATS-10G-75-C1-R0, commonly known as ‘heat sinks’, are used in a variety of industries and applications.

Types of Heat Sinks

Heat sinks come in a variety of sizes, shapes, materials, and installations that are suitable for use in the various types of industrial and consumer applications. These include single-plate heat sinks, multi-plate heat sinks, fan-type heat sinks, active (water-cooled) heat sinks, and active/passive (air-cooled) heat sinks. Most traditional heat sinks are made from aluminum, copper, stainless steel, or plastic, depending on the application and requirements.

ATS-10G-75-C1-R0 Heat Sink

ATS-10G-75-C1-R0 heat sinks are designed for low- to medium-power applications that require optimal thermal management. ATS-10G-75-C1-R0 heat sinks feature a single-plate design, with a large contact area to disperse heat efficiently. The heat sink is constructed from aluminum alloy, which ensures robustness and durability. Additionally, the aluminum provides excellent heat transfer characteristics, allowing for maximum performance. ATS-10G-75-C1-R0 heat sinks can be used in a variety of environments, from industrial and consumer applications, to scientific and research applications.

Applications of ATS-10G-75-C1-R0 Heat Sink

Common applications for ATS-10G-75-C1-R0 heat sinks include semi-conductors, motor controls, signal processors, audiovisual equipment, traffic control systems, robotics, and any other circuit boards that require active cooling. Heat sinks can also be used to protect components from environmental elements such as moisture, dust, and corrosive conditions. Heat sinks are ideal for controlling the temperature in critical circuit boards, such as those found in medical equipment, industrial motors, and aerospace applications.

Working Principle of ATS-10G-75-C1-R0 Heat Sink

Heat sinks are designed to transfer heat away from electronic components and into the surrounding environment. This is accomplished through a process called convection, wherein the heat is drawn away from the component and circulated outwards by air, liquid, or gas. The component itself does not become cooler, rather, the heat sink absorbs the heat, storing it in the form of thermal energy until it can be dissipated. If the heat is not effectively dissipated from the heat sink, the component’s temperature will continue to rise, leading to possible irreparable damage or even complete component failure.

Conclusion

Heat sinks, such as the ATS-10G-75-C1-R0, are essential to the operation of many electronic components and assemblies. By transferring unwanted thermal energy away from the component, heat sinks ensure that temperatures remain well below the critical level that would cause damage to the system or component. With its robust design and excellent heat transfer characteristics, the ATS-10G-75-C1-R0 offers a reliable and effective solution for many applications, including industrial and consumer use, as well as scientific and research applications.

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