| Allicdata Part #: | ATS-10H-03-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-03-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-03-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management technology often plays an important role in electronic device design, whether it’s dissipating the heat generated by internal components or managing the temperature of the entire system. Heat sinks, heat pipes, fan controllers, and thermoelectric coolers are all components used for cooling and temperature management. ATS-10H-03-C3-R0 is just one type of thermal management technology, and it can be categorized as a heat sink.
Heat sinks are mechanical structures made of metal or other thermally conductive material that are designed to release heat from electronics. They are commonly used to cool processors and other integrated circuits, and can come in a variety of shapes and sizes. ATS-10H-03-C3-R0 is a square-shaped heat sink that measures 60 x 60 x 10 mm and weighs 77 g. It is made of aluminum alloy with a copper base for better thermal conduction.
The main purpose of a heat sink is to disperse heat away from electronic components. The ATS-10H-03-C3-R0 works by drawing heat away from the integrated circuit or processor using a combination of natural convection, airflow facilitated by a fan, or both. The design of the heat sink allows air to flow between the fins, a type of thermal solution commonly found in other types of heat sinks.
The fins are spaced close together to increase the surface area for greater cooling performance. The heat sink also features a copper base for better thermal conduction. The combination of copper and aluminum alloy provides good heat transfer and excellent thermal dissipation.
In addition to cooling components, the ATS-10H-03-C3-R0 can also help to protect the electronic device from environmental damage. The heat sink’s aluminum alloy construction is corrosion-resistant and tarnish-resistant, and it is also UL approved, so it can be used in hazardous environments with no risk of sparking. The copper base also helps to dissipate static electricity for optimal electrical performance.
In conclusion, the ATS-10H-03-C3-R0 is a square-shaped heat sink with a copper base. It is designed to disperses heat away from electronic components and protect them from environmental damage. It is made of aluminum alloy and copper for better thermal conduction and improved cooling performance. It has a corrosion-resistant and tarnish-resistant construction and is UL approved for use in hazardous environments.
The specific data is subject to PDF, and the above content is for reference