| Allicdata Part #: | ATS-10H-04-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-04-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-04-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are designed to provide effective heat dissipation from a certain object. ATS-10H-04-C1-R0 is a thermal - heat sink designed to remove heat from electrical components. It is a high-performance heatsink for cooling computers and other electronic devices.
ATS-10H-04-C1-R0 is made up of two parts: a base and a fin array. The base is made from copper and is designed to be able to handle a wide range of temperatures. It has a large surface area which allows for excellent thermal conductivity. The fin array is made from aluminum and is designed to provide the maximum allowable surface area for cooling. The fins are designed to maximize air flow and heat dissipation.
ATS-10H-04-C1-R0 has a wide application field. It can be used in computers, servers, laptops, power supplies, and other electronic devices. The aluminum fins and copper base of the heat sink help to draw heat away from the components of the device and dissipate it into the air. This helps to keep the device from becoming overheated and improves the life and performance of the component.
The working principle of ATS-10H-04-C1-R0 is based on the thermal conductivity of copper and aluminum. Heat from the components of the device is drawn away by the copper base and then dissipated by the aluminum fins. The surface area of the fin array increases the air flow around the components, allowing for better heat dissipation. The fins help to draw the heat to the base, where it is then dissipated into the air by the large surface area of the base.
ATS-10H-04-C1-R0 is a highly effective thermal - heat sink designed to offer optimum cooling for electrical components. Its copper base and aluminum fin array provide excellent heat transfer and dissipate heat away from the components into the environment. This helps to protect the device from overheating and improves its performance. ATS-10H-04-C1-R0 has a wide application field and is a versatile and reliable solution for cooling electronic components.
The specific data is subject to PDF, and the above content is for reference