| Allicdata Part #: | ATS-10H-04-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-04-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-04-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an essential part of cooling systems for electronic devices and components. The ATS-10H-04-C3-R0 is a type of heat sink designed for multiple applications. This article will discuss the application field and working principle of this specific thermal heat sink.
The ATS-10H-04-C3-R0 is a thermal heat sink designed for applications ranging from DC-DC converters to multiple chip densities. The sink has an efficient ability to dissipate heat from electronic components and prevent the accumulation of heat. This reduces the chance of component failure due to overheating.
The ATS-10H-04-C3-R0 features a two-piece, pre-stressed aluminum design. This allows the sink to have a low thermal impedance and an improved thermal performance. The aluminum design also gives the sink an extra layer of durability which extends the life of the components.
The main feature of the ATS-10H-04-C3-R0 is its ability to dissipate heat through convection. This is achieved through the use of a heatsink base plate and a series of fins. The fins are designed to provide a large surface area to increase the heat dissipation rate. The base plate acts as a heatsink core, and the fins are designed to spread the heat around the base plate evenly. This allows the heat to be spread throughout the device and helps to maintain a consistent temperature.
Another feature of the ATS-10H-04-C3-R0 is its ability to be mounted in a variety of configurations. The device has been designed to fit into a low profile form factor, allowing for applications in tight spaces. The thermal performance of the heat sink can be improved by moving the base plate away from the enclosed space, which will increase the amount of surface area exposed to the environment.
In terms of assembly, the ATS-10H-04-C3-R0 can be easily installed by clipping it onto a mounting bracket. It is important to ensure that the environment has adequate ventilation to avoid overheating. If necessary, the sink can be tilted for a better angle to increase air flow in and around the device.
The ATS-10H-04-C3-R0 is a versatile thermal heat sink capable of performing in many different applications. Its two-piece aluminum design offers a low thermal impedance, improved thermal performance, and extended component life. The device is also able to dissipate heat through convection by using a base plate and a series of fins. Finally, the ATS-10H-04-C3-R0 can be easily installed with the use of a mounting bracket, making it an ideal choice for those looking for a reliable thermal solution.
The specific data is subject to PDF, and the above content is for reference