| Allicdata Part #: | ATS-10H-08-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-08-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-08-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component to many application designs today. From processor cooling to hot-spot thermal control, heat sinks are a key part of the equation. The ATS-10H-08-C3-R0 heat sink is an ideal choice for efficient thermal control.
ATS-10H-08-C3-R0 Application Fields
The ATS-10H-08-C3-R0 heat sink is suitable for many applications. This copper heat sink functions best in low-profile environments when in combination with a fan. Even without a fan, the ATS-10H-08-C3-R0 can provide effective thermal management in applications such as high power medical devices, power supplies, embedded boards, aerospace systems, and industrial controls. Additionally, the ATS-10H-08-C3-R0 is a good choice for mass-market consumer products such as computers, DVD players, game consoles, and TVs.
ATS-10H-08-C3-R0 Working Principle
The ATS-10H-08-C3-R0 heat sink works by dissipating heat from the component it is cooling. It is constructed from copper which is highly conductive and therefore transfers the heat quickly and effectively. Heat is dissipated away from the component by means of convection and by conduction when a fan is used. The heat sink utilizes fins to further enhance the process of heat transfer away from the component.
The ATS-10H-08-C3-R0 heat sink features a powder-coated fin design that provides efficient heat transfer. It is also designed to reduce extraneous sound levels and features a unique fin design that offers superior airflow and stability. The heat sink is also designed to be resistant to corrosion, making it a durable, dependable option for any application.
Conclusion
The ATS-10H-08-C3-R0 heat sink offers efficient thermal control through conduction and convection when used in low-profile environments. The heat sink is constructed of copper which has excellent heat conductivity, as well as being resistant to corrosion. Additionally, the heat sink is designed with a powder-coated fin design that enhances convection cooling, as well as reducing extraneous sound levels. The ATS-10H-08-C3-R0 is suitable for many applications, from medical devices to DVD players and is a great choice for efficient thermal management.
The specific data is subject to PDF, and the above content is for reference