| Allicdata Part #: | ATS-10H-09-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-09-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-09-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal technology has been a focus within the electronic industry for quite some time now, due to its significant impact on the overall performance of the electronic components. Heat sinks are a type of passive cooling technology that manages the heat produced by electronic components in order to improve the performance and reliability. ATS-10H-09-C1-R0 is a popular heat sink within this industry, and comes with a wide range of specifications.
The ATS-10H-09-C1-R0 Heat Sink offers superior thermal performance and wide operating temperature range. It features an effective resistance area and minimum thermal resistance, which ensures higher levels of efficiency. It utilizes a combination of aluminum fins and copper base construction, which helps in maximized heat dissipation. It also has a profile height that can easily fit into electrical enclosures and systems.
The design of the ATS-10H-09-C1-R0 Heat Sink is well balanced and offers a precise radiative area and optimal airflow. This ensures that the heat produced is quickly and effectively dissipated. The copper base ensures that the heat is evenly spread across the fin array which helps in preventing hotspots. The fan also does a great job in directing the airflow to the various areas of the heat sink to help reduce the thermal resistance. It also reduces the total air pressure relative to the diameter of the fan, which leads to a more efficient cooling performance.
The ATS-10H-09-C1-R0 Heat Sink can be used in a variety of applications including computers, servers, industrial control systems, and vehicle engines. It is also ideal for use as a heat sink in multi-processor systems that require releasing a large amount of heat, as the thermal resistance is minimized by the addition of copper underneath the fin array. It is also perfect for use in a computer chassis, as its compact size and low weight ensure efficient space utilization.
The working principle of this product is relatively simple. By increasing the surface area, it is able to release large amounts of heat. This process is facilitated by the presence of aluminum fins and copper base, thus allowing more air and heat to be channeled through the heat sink. This heat is then dissipated into the surrounding environment due to the low thermal resistance. The fan also helps to direct the airflow constantly, ensuring the efficient cooling performance of the heat sink.
The ATS-10H-09-C1-R0 heat sink is a reliable and efficient thermal solution for various applications. It features a combination of aluminum fins and copper base, which ensures an optimal cooling performance. It also has an efficient configuration in terms of space utilization, making it ideal for use in a variety of electronic enclosures and systems. The working principle is relatively simple, as it is designed to channel a large amount of heat through the heat sink and quickly dissipate it into the surrounding environment. It is easy to install and requires minimal maintenance, making it a great choice for thermal management in modern electronic devices.
The specific data is subject to PDF, and the above content is for reference