| Allicdata Part #: | ATS-10H-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-10H-10-C3-R0 thermal heat sink is a metal component designed to dissipate heat from a specific electronic device. The component works by transferring the heat generated from the electronic device to the air, thereby maintaining its temperature. The ATS-10H-10-C3-R0 heat sink is composed of a base metal plate, a radiator fin assembly, and an aluminum heat exchange system.
The base metal plate is the most important part of the ATS-10H-10-C3-R0 thermal heat sink. It is typically made of a combination of aluminum alloy and copper, which provides better thermal conductivity and a good structural frame. The aluminum alloy and copper materials are machined into specific shapes and sizes to ensure optimal heat dissipation. The device is also equipped with mounting holes and threads, allowing for easy installation and secure joining.
The radiator fin assembly is made up of multiple thin radiator fins sandwiched between layers of metal. These fins are designed to allow for maximum air circulation around the heat sink, promoting greater cooling capability. The aluminum heat exchange system works by transferring heat away from the device to the surrounding environment. This is done by creating air circulation through the radiator fin assembly. The air absorbs the heat and is drawn away from the device, thereby helping to maintain the optimal operating temperature.
The ATS-10H-10-C3-R0 thermal heat sink can be used in a variety of electronic devices and applications. It is commonly used in power electronics, telecommunications, and aerospace systems. One of its most popular applications is in personal computers. The heat sink is placed near the processor to keep it cool while under heavy load during long periods of usage. It is also used in medical electronics, telecommunications, automotive engine systems, and other electronic devices.
The ATS-10H-10-C3-R0 thermal heat sink has been designed to offer superior cooling capabilities while also providing low noise levels. Due to its strong thermal conductivity and structural frame, the device is quite durable. Additionally, the heat sink is easy to install and is available in a variety of different sizes and shapes, making it suitable for many different applications.
The ATS-10H-10-C3-R0 thermal heat sink is an effective cooling solution for a variety of electronic devices and applications. By transferring heat away from critical components, the device helps to ensure that all systems operate at their optimal temperature. Additionally, because of its strong thermal conductivity and structural frame, the device is quite durable and offers a high level of reliability.
The specific data is subject to PDF, and the above content is for reference