ATS-10H-107-C1-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	27.91°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction of ATS-10H-107-C1-R1

The ATS-10H-107-C1-R1 is a high performance, low profile, thermally optimized heat sink designed specifically for power electronics applications in ultra-high power density systems. The ATS-10H-107-C1-R1 is designed to dissipate dissipated heat from exposed circuit boards or directly mounted, high power density devices in a variety of power systems including solar power, server blades, telecommunications equipment and industrial process control systems.

Application of ATS-10H-107-C1-R1

The ATS-10H-107-C1-R1 is designed to support thermal management in a variety of power systems and high power density applications. It is particularly well suited to low profile systems in which the physical size of the application is critical. It is also well suited to ultra-high power density applications in which heat dissipation needs to be managed by both internal cooling, such as fans and internal blowers, and external heat sinks. In addition, the ATS-10H-107-C1-R1 is designed specifically for use in highly dynamic, light load applications, where an extremely low profile is necessary to satisfy size constraints.The ATS-10H-107-C1-R1 is ideal for applications that require high thermal efficiency and extended life, such as telecom, automotive, medical, military, and industrial electronics. The design includes a low profile profile heat sink that is designed to dissipate heat quickly and efficiently, without the risk of exceeding thermal limitations, even under high ambient temperatures.

Working Principle of ATS-10H-107-C1-R1

The ATS-10H-107-C1-R1 utilizes a combination of proprietary heat sinks and advanced thermal interface materials to maximise thermal performance. It is designed to ensure maximum efficiency of thermal conductivity between the base plate and the surface on which the heat spreader is mounted.A multitude of heat spreaders are integrated into the design, ensuring heat is efficiently directed away from the component. The combination of radiating fins and heat spreaders dissipate heat quickly and evenly throughout the body of the heat sink, ensuring optimal heat dissipation.The ATS-10H-107-C1-R1 also uses special high-performance thermal interface materials designed for high temperature, high load applications. The materials enhance thermal performance by minimising the thermal resistance between the surface and the heat spreader, and eliminating potential air gaps between the two.

Conclusion

The ATS-10H-107-C1-R1 is a thermal - heat sink designed to manage heat dissipation from a variety of high power density, low profile applications. It is designed to dissipate heat quickly and efficiently, while also providing a low profile profile system that is easy to install and maintain. Through the combination of proprietary heat sinks and advanced thermal interface materials, the ATS-10H-107-C1-R1 is able to provide superior thermal performance and extended service life.

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