| Allicdata Part #: | ATS-10H-109-C1-R1-ND |
| Manufacturer Part#: |
ATS-10H-109-C1-R1 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10H-109-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical part of any electronic device. Heat dissipating solutions are designed to keep components cool, prolonging life and reliability of the system. The ATS-10H-109-C1-R1 heat sink solutions provide an efficient, low-cost solution for keeping electronic devices cool and safe from overheating.
The ATS-10H-109-C1-R1 heat sink is designed to work with all standard electronic devices in many applications. This heat sink is constructed of copper and aluminum, both excellent conductors of heat. It features a large surface area, allowing for increased heat dispersion, while the extended fins provide excellent heat dissipation and increased airflow. Additionally, this heat sink features a unique mounting system with adhesive tape, allowing for easy installation in any system.
The ATS-10H-109-C1-R1 has applications in a wide range of electronic devices, including computers, servers, routers, and media centers. It is an ideal choice for cooling down these types of systems because it can effectively dissipate heat without taking up too much space. Additionally, the heat sink is lightweight and affordable, making it a great option for those on a tight budget.
The ATS-10H-109-C1-R1 works on the principle of thermal conduction, where the heat produced by the electronic components is transferred to the heat sink, and then dissipated into the surrounding environment. The metal components of this heat sink are good conductors of heat, allowing for the efficient and effective removal of heat from the device. Furthermore, the surface area allows for the maximum amount of air to be exposed to the heat sink, providing a great cooling solution.
The ATS-10H-109-C1-R1 heat sink is a reliable and effective way to keep electronic components cool and safe from overheating. It is constructed of lightweight materials, making it easy to install and remove, and its adhesive mounting system allows it to be securely attached. Additionally, this heat sink is an affordable solution that provides optimal cooling performance without taking up too much space. With its efficient heat dispersal design, the ATS-10H-109-C1-R1 is an ideal choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference
ATS-10H-109-C1-R1 Datasheet/PDF