| Allicdata Part #: | ATS-10H-113-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-113-C1-R0 |
| Price: | $ 3.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-113-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.75814 |
| 30 +: | $ 2.68359 |
| 50 +: | $ 2.53436 |
| 100 +: | $ 2.38531 |
| 250 +: | $ 2.23625 |
| 500 +: | $ 2.16171 |
| 1000 +: | $ 1.93808 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a widely used component in electronics requiring heat dissipation. The ATS-10H-113-C1-R0 Heat Sink is a popular choice for applications requiring a large size, high output heat dissipater. This Heat Sink can be used in a range of applications but is typically used in larger, higher power, more advanced electronics.
The ATS-10H-113-C1-R0 consists of an aluminum base, fin stack, and extruded fins all connected together using a clip. The fin stack and extruded fins increase the surface area and heat dissipation efficiency of the heat sink. The base is designed for securely mounting either horizontally or vertically to the application board or casing. The clip helps provide additional attachment security and strength when mounting the heat sink in place.
The ATS-10H-113-C1-R0 is designed to draw in air from the environment and distribute it evenly across the fins without any backpressure or fan noise. The airflow increases as the temperature within the heat sink rises, resulting in a higher rate of heat dissipation. This allows the heat sink to more effectively cool electronic components by absorbing their excess heat.
The ATS-10H-113-C1-R0 is capable of cooling components up to 500 Watts with an output of up to 200 Watts per square inch. It is designed to operate in temperatures ranging from -40 to +50°C. This heat sink is lightweight, easy to install, and offers excellent vapor absorption, making it an ideal choice for a variety of applications where thermal management is necessary.
The ATS-10H-113-C1-R0 is suitable for use in a broad range of electronics, including power supplies, motors, and communication systems. Additionally, it is suitable for use in automotive applications, communications equipment, consumer electronics, power converters, and industrial equipment.
Overall, the ATS-10H-113-C1-R0 is an ideal choice for large, higher powered electronics requiring thermal management. Its lightweight, easy to install design, and excellent vapor absorption ensure it is suitable for a variety of applications. The ATS-10H-113-C1-R0 is capable of cooling components up to 500 Watts, with an output of up to 200 Watts per square inch, making it a reliable choice for improving the overall performance of your electronics.
The specific data is subject to PDF, and the above content is for reference