ATS-10H-124-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.25°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal management is an important factor in many different industries ranging from power supplies to telecommunications. Heat sinks are a crucial component of thermal management, used to dissipate heat away from sensitive components. The ATS-10H-124-C3-R0 is a high-performance heat sink for applications where heat transfer or thermal regulation are of the utmost importance. This article will discuss the application field and working principle of the ATS-10H-124-C3-R0, as well as its advantages and benefits.

Application Field of ATS-10H-124-C3-R0

The ATS-10H-124-C3-R0 heat sink is designed for high-power electronic devices used in a variety of industries, including industrial automation, defense electronics, medical devices, power supplies, and telecommunications. It is also well-suited for use in high-surface-mount integrated circuits. With its low profile design and short overall length, the ATS-10H-124-C3-R0 is well-suited for small spaces, providing maximum cooling performance in tight spaces.

Working Principle of ATS-10H-124-C3-R0

The ATS-10H-124-C3-R0 uses a quick-connect design with integrated heat pipes and optimized fin structures, allowing it to cool component temperatures faster than traditional heat sinks. Heat dissipation is achieved through a combination of conduction, convection, and radiation. Heat generated by the device is first transferred to the heat pipes, which are connected directly to the heat transfer device. The heat is then transferred from the heat pipes to the fin structures, which provide more surface area for efficient heat transfer. Finally, the fin structures dissipate the heat into the surroundings via radiation and convection.

Advantages of ATS-10H-124-C3-R0

The ATS-10H-124-C3-R0 provides several advantages over conventional heat sinks. For example, its quick-connect design and integrated heat pipes make installation and maintenance much easier. It also features a lightweight design, reducing the overall weight of devices that use it. Additionally, its optimized fin structures provide a greater surface area for more efficient cooling performance.Finally, the ATS-10H-124-C3-R0 features a low profile design, making it ideal for use in devices with limited space. It is also designed to dissipate heat faster than traditional heat sinks, allowing for greater thermal performance and reliability.

Benefits of ATS-10H-124-C3-R0

The ATS-10H-124-C3-R0 provides excellent thermal performance and reliability, making it ideal for various applications. Its quick-connect design and integrated heat pipes make installation and maintenance easier, while its optimized fin structures provide greater surface area for increased cooling performance. Additionally, its low profile design allows for use in even the most space-limited applications. Overall, the ATS-10H-124-C3-R0 provides superior performance and reliability for a wide variety of applications.

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