| Allicdata Part #: | ATS-10H-125-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-125-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-125-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
thermal management is an important consideration when designing electrical and electronic systems. Heat generated by electrical and electronic components needs to be dissipated quickly and efficiently to protect components from overheating and degradation. ATS-10H-125-C3-R0 is a type of thermal - heat sink, which is a device used to dissipate heat from electrical and electronic components. In this article, we\'ll look at the application fields and working principle of the ATS-10H-125-C3-R0 thermal - heat sink.
The ATS-10H-125-C3-R0 thermal - heat sink is suitable for a range of applications, including power supplies, inverters, voltage regulators and other electronics. It is a low thermal resistance material which means that heat generated by components can be quickly and efficiently dissipated into the ambient air. The ATS-10H-125-C3-R0 has a large range of sizes and shapes, making it suitable for a variety of applications.
The ATS-10H-125-C3-R0 is designed to have a high thermal conductivity, which allows it to efficiently transfer heat away from the heat-generating components. The ATS-10H-125-C3-R0 is also designed to have a low profile so that it can be easily fitted in tight spaces. In addition, the ATS-10H-125-C3-R0 has a high surface area to air ratio, which ensures the maximum amount of heat is dissipated from the heat generating components. This helps to keep the components at an optimal operating temperature.
The ATS-10H-125-C3-R0 works on an active cooling principle. It absorbs and disperses the heat generated from the component into its own structure. This is done using thermoelectric materials which transfer heat from the component to the heat sink. The heat sink then dissipates the heat into the surrounding environment by conduction, convection or radiation.
It\'s important to note that the thermal - heat sink can only dissipate heat away from the components as much as the ambient environment can allow. For optimal performance, the ATS-10H-125-C3-R0 should be placed in an area with adequate air movement to prevent the heat from getting trapped within the heat sink.
The ATS-10H-125-C3-R0 thermal - heat sink is an effective and efficient way to keep electrical and electronic components cool and functioning optimally. It is suitable for a range of applications and is designed to quickly and efficiently dissipate heat into the ambient air. Its low profile design makes it easy to fit into tight spaces and the high surface area to air ratio ensures that heat is dissipated quickly and efficiently. Thanks to its active cooling technology, it can quickly transfer heat away from the components, helping to keep them at an optimal operating temperature.
The specific data is subject to PDF, and the above content is for reference