ATS-10H-126-C3-R0

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Thermal management is essential for many electronic products. Heat generated by components must be dissipated to ensure components have a low enough temperature for proper operation. Heat sinks are passive components used to help dissipate heat away from components, and keep temperatures at an acceptable level.

The ATS-10H-126-C3-R0 is a thermal management heat sink that is widely used in many applications. It is a compression-mount heat sink manufactured using extruded aluminum. It is designed to meet the needs of various thermally aggressive systems, from high-power, surface-mount plastics to high-performance CPUs in rack-mounted systems with a small form factor.

In terms of physical dimensions, the ATS-10H-126-C3-R0 measures 126 millimeters wide, 120 millimeters deep, and 25 millimeters high (WxDxH). It is a good size for medium-end applications that require heat sinks that can easily fit into tight spaces or are narrow in size. It includes a mounting system that employs bypass pins, and the fins are press-fit into the heat sink’s framework for more efficient heat conduction.

The ATS-10H-126-C3-R0 is also able to provide good thermal performance due to its superior thermal design. It has a thick fin profile with a height of approximately 5 millimeters, which makes the fins more efficient at dissipating heat. The two sets of the fins can easily remove about 10 to 15 watts of heat in a better manner. The heat dissipation capacity of the ATS-10H-126-C3-R0 is up to 12 watts.

The heat sink also features an internal pin-milled section for improved heat dissipation, and a black anodized finish on its surface. This black anodized finish helps keep the heat sink free of corrosion and discoloration, making it extremely durable in difficult environmental conditions.

The heat sink also features an aluminum base plate for maximum heat exchange between the components and the heat sink, and a specially designed airflow channel that provides uniform pressure and airflow across the surface of the fins for better cooling performance. It also features a fin area of more than 1300cm² and an airflow rate of up to 17CFM.

For applications requiring higher thermal performance, the heat sink is also available in an optional active shroud version. The active shroud is a fan that is positioned directly behind the heat sink, providing an additional boost in thermal performance. Combined with the pin-milled section and the black anodized finish, the active shroud version can help dissipate heat more effectively, up to 25 watts.

The ATS-10H-126-C3-R0 is an ideal thermally-aggressive solution for many applications. It is easy to install, as it does not require special mounting hardware, and is available in a wide range of sizes for different form factors. Its features make it ideal for applications such as CPUs, power transistors, voltage regulators, FPGAs, and GPUs, and its excellent thermal performance makes it a great choice for medium-level applications.

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