ATS-10H-129-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal technology has become increasingly prevalent in everyday electronics and has led to the development of several sophisticated products in the field. The ATS-10H-129-C1-R0 is one such product and is commonly used for the transfer and dissipation of heat from processor chips in a wide range of electronics. This article will explore the application fields and working principle of the ATS-10H-129-C1-R0.

The ATS-10H-129-C1-R0 is a thermally advanced heat sink designed to be used in high-performance electronic devices where the temperature of the processor chips must be kept at an acceptable level. This product consists of a base plate that is made from an aluminum alloy and features grooves and fins on its surface that are designed to dissipate heat from the electronic components. The fins are arranged in a radial pattern and the grooves are filled with a high-performance thermal conducting compound that serves to enhance the thermal transfer capabilities of the product. Additionally, the ATS-10H-129-C1-R0 also features air-circulation holes and various mounting options that make it suitable for a wide variety of application fields.

The most common application field of the ATS-10H-129-C1-R0 is in personal computers and laptops as it is capable of cooling the processor chips, allowing them to run faster and for longer periods of time. Additionally, this product can also be used in servers and embedded systems, thus allowing for the efficient dispersion of heat in cases of high-powered electronics. Furthermore, because of its grooved and finned construction, this product can also be used in industrial machines, medical equipment, telecommunications, and other applications where the dissipation of heat from the processor chips is necessary.

The working principle of the ATS-10H-129-C1-R0 is relatively simple and relies on the transfer of heat from the processor chips to the air-circulation holes and then to the fins. This process works by taking advantage of the natural convection process, where warm air rises, and causes a circulation of air around the processor chips. This convective flow transfers heat from the processor chips to the fins of the heat sink. The finned construction reduces the stagnant air layers surrounding the processor chips, thus making the transfer of heat more efficient. Additionally, the grooves of the product are filled with a high-performance thermal conducting compound that further enhances the thermal transfer capabilities of the product.

In conclusion, the ATS-10H-129-C1-R0 is a thermally advanced heat sink designed to be used in high-performance electronic devices where the temperature of the processor chips must be kept at an acceptable level. This product is especially useful in applications such as personal computer and laptops, servers, embedded systems, industrial machines, medical equipment, telecommunications, and other areas where heat dissipation is necessary. Its impressive thermal transfer capabilities are enabled by its finned construction and the grooves that are filled with a high-performance thermal conducting compound. This product thus ensures that the processor chips can run at optimal temperatures and performance levels.

The specific data is subject to PDF, and the above content is for reference