| Allicdata Part #: | ATS18324-ND |
| Manufacturer Part#: |
ATS-10H-129-C2-R0 |
| Price: | $ 5.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-129-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.76910 |
| 10 +: | $ 4.63806 |
| 25 +: | $ 4.38052 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of industrial and electronic manufacturing the world over. Heat generated from components like processors, motors, and drives can lead to major problems if not efficiently managed. Without cooling, breakdowns and other damage may occur. With advances in technology and electronics, thermal management solutions have advanced in kind. ATS-10H-129-C2-R0 is one such thermal management product, designed to be used in applications with medium to large size heat loads.
ATS-10H-129-C2-R0 is a type of heat sink – a thermoelectric device used for thermal management. Heat sinks consist of a thermal base, such as aluminum or copper, and fins which extend outward from it. Heat generated from components in the device is transferred to the heat sink fins, where it is then dissipated as the transpiration of air across the surface. Heat sinks are typically used to cool components on circuit boards, high-end processors, and other high-powered devices.
ATS-10H-129-C2-R0 is a popular heat sink in the electronics market, designed for thermal management applications in medium to large size heat loads. The device consists of an aluminum base with copper fins, providing a higher level of thermal performance than its all-aluminum counterparts. The device comes with a maximum power dissipation rating of 50 watts, making it an ideal choice for components with high heat dissipation characteristics.
The working principle of a heat sink like ATS-10H-129-C2-R0 is relatively straightforward: as heat is applied to the fins via direct contact or by a thermoelectric element, the heat is dissipated away from the component and into the air due to the conduction of heat along the base and the fins. This heat transfer occurs due to the fins being cooler than the components, and the air surrounding them being cooler still. As the heat is conducted away, it is dissipated out of the heat sink.
With the increasing demand for electronic components with higher levels of performance and power, thermal management solutions have become increasingly important. Heat sinks like ATS-10H-129-C2-R0 offer an ideal solution for managing high power loads. With their aluminum and copper construction and 50-watt dissipating power rating, they are especially suited for medium to large size heat loads, providing a reliable and efficient cooling solution. By properly managing heat generated by components, the life of the components can be extended, resulting in greater performance for longer.
The specific data is subject to PDF, and the above content is for reference