| Allicdata Part #: | ATS-10H-133-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-133-C1-R0 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-133-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.41°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10H-133-C1-R0 is a thermal architecture designed for cooling high-power electronics in various equipment. This air-forced heat sink is an effective way to dissipate heat from components like transistors and chips. In order to keep high internal component temperatures and avert risk of long-term damage, the ATS-10H-133-C1-R0 was designed to be installed above components so that the maximum surface area is exposed to the air. The fan that accompanies the sink works on a centrifugal force system to draw in cool air through the top of the fan, thereby increasing the rate of heat dissipation from the components below.
The ATS-10H-133-C1-R0 is capable of operating at temperatures between -20 and +65°C. Its use is applicable to a wide variety of applications, primarily those that involve digital circuitry or other highly sensitive thermal control devices. The air-forged design means that the fans can be used to cool complex boards and chips, such as those used in consumer electronics, medical equipment, communication networks, aerospace, telecommunications, and Internet of Things devices.
In order to make the best use of the ATS-10H-133-C1-R0, attention needs to be paid to the exhaust velocity and air volume to ensure that the temperature across the components is efficiently managed. High input voltage and low start-up current ensure minimal power consumption and noise levels. Additionally, this thermal architecture is designed to be robust and durable in order to provide a long lasting solution. The fan design also ensures efficient air circulation which means that internal components are efficiently cooled, thereby extending their life.
In summary, the ATS-10H-133-C1-R0 is a highly efficient and cost-effective thermal architecture designed for cooling components in a variety of applications. Its air-forced design enables efficient cooling of high-power components, while its smart design ensures optimal temperature management without power overload. Thanks to its fan design, this thermal architecture also ensures low noise levels and minimal power consumption.
The specific data is subject to PDF, and the above content is for reference