ATS-10H-134-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-10H-134-C3-R0 Application Field and Working Principle

Introduction

Thermal heat sinks, also known as passive cooling systems, are used to dissipate thermal energy away from heat-generating electronic components. The ATS-10H-134-C3-R0 is an innovative heat sink specifically designed for the high thermal load applications such as the automotive fields and extreme temperatures. ATS-10H-134-C3-R0 is suitable for cooling of medium and large size electronics, and it\'s also suitable for the cooling of power modules.

Design Features

The design of the ATS-10H-134-C3-R0 has many features that make it an ideal choice for high thermal load applications. Firstly, the die-cast aluminum alloy design of the heat sink offers superior mechanical strength and allows for a lightweight and highly efficient design. In addition, the high-performance copper alloy plates help to transfer the thermal energy away from the heat source quickly and effectively. The unique fin design of the heat sink also helps to maximize airflow around the device, which significantly increases its performance and cooling efficiency. Additionally, the ATS-10H-134-C3-R0 has an integrated mounting system, which allows it to be quickly and easily installed onto any compatible circuit board.

Working Principle

The ATS-10H-134-C3-R0 utilizes an advanced passive cooling system to dissipate the thermal energy produced by the heat source. The heat sink is designed to absorb the thermal energy from the hot component and then disperse it to the surrounding environment. As the thermal energy is dissipated, the air around the heat sink is cooled, which helps to reduce the temperature of the heat source. In addition, the unique fin design of the ATS-10H-134-C3-R0 further improves its cooling performance by allowing for increased airflow around the device. This helps promote maximum efficiency, which is particularly important in applications where high thermal load is an issue.

Benefits

Using the ATS-10H-134-C3-R0 heat sink has many benefits, including improved reliability, increased efficiency, and cost savings. The design of the heat sink ensures that it is able to dissipate the thermal energy quickly and safely away from the device, resulting in improved system reliability. Additionally, the lightweight design of the heat sink allows for easy installation, and the integrated mounting system helps to reduce installation time and cost. Furthermore, the innovative fin design and high-performance materials used in the heat sink ensure maximum cooling efficiency, which is essential for applications that generate high levels of thermal heat.

Conclusion

The ATS-10H-134-C3-R0 heat sink is an excellent choice for applications that generate high levels of thermal heat. The unique design and high-performance materials used in the heat sink allow for superior cooling performance and improved system reliability. In addition, the lightweight design and integrated mounting system make it easy to install onto any compatible circuit board, resulting in cost savings and increased efficiency. With its many features and benefits, the ATS-10H-134-C3-R0 heat sink is an ideal choice for any high thermal load application.

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