| Allicdata Part #: | ATS-10H-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component in various electronics applications. They are responsible for accommodating thermal energy by dissipating the heat away from a device or component that generates too much heat. Thus, they prevent the source of the heat from becoming too hot and causing damage to the device or component in the process. ATS-10H-139-C1-R0 is a heat sink that is typically used to transfer heat from LEDs, high power transistors and other electronics components. This heat sink is mainly used in the LED lighting industry, electrical and electronics industry, communication and broadcasting industry, and other fields.
The ATS-10H-139-C1-R0 heat sink is constructed from 6063 aluminum alloy, which is a lightweight yet highly efficient metal that can dissipate heat quickly and efficiently. This heat sink features a simple pin fin design that enables high thermal performance and low air resistance. It has been designed to offer an optimized cooling solution for devices that produce high thermal energy. The dimensions of the heat sink are 135 x 28 x 21.6mm, making it lightweight and compact.
The ATS-10H-139-C1-R0 features an extruded aluminum base and a thermal resistant PCB that allows for non-conductive heat dissipation. The thermal pad of the heat sink has been designed to provide a better heat conduction between the heat source and the heat sink. It has an enhanced thermal performance with a maximum temperature limit of 80 degrees Celsius. The heat sink also comes with six integrated mounting holes which enable quick and easy installation.
The working principle behind ATS-10H-139-C1-R0 is convection. Convection is a type of heat transfer that occurs when the heat is transferred from one object to another through air or a liquid. In this type of heat transfer, the hot air or water present in the area is circulated around the area and acts as a medium for heat transfer. When the heat sink is attached to the heat generating device, it cools down the heated air or liquid and transfers the heat away from the device, allowing it to function at optimal performance levels.
In conclusion, the ATS-10H-139-C1-R0 is a highly efficient and lightweight heat sink that is designed for various thermal management applications in the LED lighting industry, electrical and electronics industry, communication and broadcasting industries, and other fields. It comes with a thermal resistant PCB for efficient heat dissipation and can reach a maximum temperature of 80 degrees Celsius. The working principle behind ATS-10H-139-C1-R0 is convection heat transfer, which makes it an ideal choice for cooling down devices that generate large amounts of heat.
The specific data is subject to PDF, and the above content is for reference