| Allicdata Part #: | ATS-10H-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Heat sinks are devices that are used to dissipate dissipated heat related to electronic devices. ATS-10H-14-C1-R0 is just one type of heat sink that is specifically designed to provide thermal management solutions for applications that require a 10mm fin spacing and a height of 14mm. This heat sink is also characterized by a low profile design and low air resistance due to its improved cross-sectional flow area.
The working principles of heat sinks are based on the process of thermal energy transfer. Essentially, when heat is generated by an electronic device, this heat is transferred from the hot component of an electronic device to the surrounding medium, usually through the process of convection. When a heat sink is present, this heat transfer process is increased significantly due to the presence of cooling fins that increase the surface area exposed to the ambient air. This helps to dissipate the heat much faster than the natural process of convection.
The ATS-10H-14-C1-R0 is designed to be used in applications that require effective thermal management solutions. It is equipped with a base fin design to increase the thermal performance, as well as an optimized pin pattern to reduce the thermal resistance and increase the flow of cool air. This is achieved by improving the cross-sectional flow area of the device, resulting in a heat sink with a low profile design and a much better airflow. In addition, this device is also equipped with a C1-R0 anodic protective surface, which helps to protect the device against oxidation and corrosion over time.
Furthermore, this device is also designed to be able to handle a wide range of heat dissipation requirements. It can handle up to 10 watt of power dissipation and is able to operate at temperature ranges between -40°C and 75°C. The fin spacing is also adjustable, allowing users to customize the thermal performance of their device to achieve the desired levels of heat dissipation. This flexibility makes the ATS-10H-14-C1-R0 well-suited for a variety of applications across various industries.
Overall, the ATS-10H-14-C1-R0 is a versatile heat sink that can be used in a variety of applications requiring successful heat dissipation. It is designed to enhance the thermal performance of its components by increasing the surface area exposed to the ambient air. In addition, its adjustable fin spacing, low profile design, and anodic protective surface make it an ideal choice for any application requiring effective thermal management solutions.
The specific data is subject to PDF, and the above content is for reference