| Allicdata Part #: | ATS-10H-147-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-147-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10H-147-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are cooling systems that are used in various forms of electronic equipment. The systems are designed to dissipate large amounts of heat energy produced by components and devices, such as processors, resistors, transistors, and other similar parts. This dissipated energy is then converted into a more stable, low-temperature energy form, thus allowing the device to remain operationally stable. The ATS-10H-147-C1-R0 is one such type of thermal-heat sink system.
The ATS-10H-147-C1-R0 is designed for use in high-end server and desktop computers. It has a thermal-conductivity rating of 10 watts per square meter of surface, and is comprised of a base and four retention brackets. The base is made of a steel mesh, and the four retention brackets are made from aluminum. The purpose of the retention brackets is to ensure that the base is securely attached to the computer\'s motherboard. The base further contains 140 fins of varying sizes, and these fins are essential for the dissipation of heat.
The ATS-10H-147-C1-R0 works by using natural convection to draw heat away from its surface. The heatsink absorbs heat from the device to which it is attached, and then releases that heat into the cooler ambient air. The heat is dissipated as air moves through the fins and out of the heat sink. As the air passes through the fins, it is warmed, causing the heat to be dissipated instead of being sent back to the device.
In addition to the fins, the ATS-10H-147-C1-R0 also uses an advanced cooling technology called "vapor chamber technology." This technology is designed to draw heat away from the components more efficiently than traditional heatsink systems. The vapor chamber uses a combination of heat sinking and evaporation to effectively draw more heat from the components. This vapor chamber reduces the amount of heat that is transferred to the motherboard, thus increasing the system\'s overall thermal efficiency.
The ATS-10H-147-C1-R0 is an ideal choice for anyone looking to keep their high-end computers cool and running efficiently. It will work for both desktop and server systems, and is easily installed with the four retention brackets. With its advanced vapor chamber technology, it is able to dissipate considerable amounts of heat energy more efficiently than traditional heat sinks. The ATS-10H-147-C1-R0 is an excellent choice for anyone seeking a reliable thermal-heat sink system.
The specific data is subject to PDF, and the above content is for reference
ATS-10H-147-C1-R0 Datasheet/PDF